DATA SHEET
www.onsemi.com
© Semiconductor Components Industries, LLC,2004
February, 2022 − Rev. 3
1 Publication Order Number:
MMBD4148SE/D
Small Signal Diode
MMBD4148SE,
MMBD4148CC,
MMBD4148CA
Features
• These are Pb−Free Devices
MAXIMUM RATINGS (T
A
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Maximum Repetitive Reverse Voltage V
RRM
100 V
Average Rectified Forward Current I
F(AV)
200 mA
Non−Repetitive Peak Forward
Surge Current
Pulse Width = 1.0 s
Pulse Width = 1.0 ms
I
FSM
1.0
2.0
A
Operating Junction Temperature Range T
J
−55 to +150 °C
Storage Temperature Range T
STG
−55 to +150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic Symbol Value Unit
Power Dissipation P
D
350 mW
Thermal Resistance, Junction−to−Ambient R
q
JA
357 °C/W
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Breakdown Voltage
I
R
= 5.0 mA
I
R
= 100 mA
V
R
75
100
−
−
−
−
V
Forward Voltage
I
F
= 10 mA
V
F
− − 1.0
V
Reverse Leakage Current
V
R
= 20 V
V
R
= 20 V, T
A
= 150°C
V
R
= 75 V
I
R
−
−
−
−
−
−
25
50
5.0
nA
mA
mA
Total Capacitance
V
R
= 0 V, f = 1.0 MHz
C
T
− − 4.0
pF
Reverse Recovery Time
I
F
= 10 mA, V
R
= 6.0 V,
I
RR
= 1.0 mA, R
L
= 100 W
t
rr
− − 4.0
ns
Product parametric performance is indicated in the Electrical Characteristics for
the listed test conditions, unless otherwise noted. Product performance may not
be indicated by the Electrical Characteristics if operated under different conditions.
SOT−23 (TO−236)
CASE 318−08
1
2
3
1
DxM G
G
Dx = Device Code
x = 4, 5, 6
M = Assembly Operation Month
G = Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
See detailed ordering and shipping information on page 4
of this data sheet.
ORDERING INFORMATION
CONNECTION DIAGRAMS