-. Device : ASFC8G31M-51BIN
-. Package :
11.5 x 13.0 F153 eMMC
-. Weight (mg) : 261.9mg
Material Substan
ces Vendor Type Purpose CAS No.
Weight
(mg)
El
ement wt
(%)
wt %
of Total
unit wt
PPM
Silicon Chip 1
Silicon (Si)
SMI
SM2736 Controller
Circuit
-
1.720
0.66%
100.00%
6567
Silicon Chip 2
Silicon (Si)
SEC
8GB Nand Flash
Circuit
-
51.430
19.64%
100.00%
196372
Silica, vitreous
Filler
60676-86-0
106.466
40.65%
87.80%
406513
4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethyl(1,1'-biphenyl)
Resin
85954-11-6
4.244
1.62%
3.50%
16205
Phenol polymer with 1,4-bis(methoxymethyl)benzene
Resin
26834-02-6
3.032
1.16%
2.50%
11575
Phenol polymer with 4,4'-bis(methoxymethyl)1,1'-bisphenyl
Resin
205830-20-2
2.910
1.11%
2.40%
11112
Formaldehyde polymer with (chloromethyl)oxirane and 2-methylphenol
Resin
29690-82-2
3.032
1.16%
2.50%
11575
Magnesium hydroxide
Hardener
1309-42-8
0.970
0.37%
0.80%
3704
Carbon black
Colorant
1333-86-4
0.606
0.23%
0.50%
2315
100.00%
Glass cloth
Base meterial, Core composition (CCL)
65997-17-3
7.100
2.71%
10.58%
27109
Copper
Base meterial, Core composition (CCL)
7440-50-8
11.900
4.54%
17.73%
45437
Epoxy
Base meterial, Core composition (CCL)
28906-96-9
0.900
0.34%
1.34%
3436
Heat Resistant Resin
Base meterial, Core composition (CCL)
25722-66-1
0.900
0.34%
1.34%
3436
Silica Filler
Base meterial, Core composition (CCL)
7631-86-9
1.500
0.57%
2.24%
5727
Resistant Epoxy Resin
Base meterial, Core composition (CCL)
223769-10-6
0.900
0.34%
1.34%
3436
Metal Hydroxide
Base meterial, Core composition (CCL)
1318-23-6
0.700
0.27%
1.04%
2673
Acrylate resin
Base meterial, Solder Mask composition (PSR4000-AUS308)
Trade Secret
7.000
2.67%
10.43%
26728
Organic pigments
Base meterial, Solder Mask composition (PSR4000-AUS308)
Trade Secret
0.100
0.04%
0.15%
382
Phthalocyanine blue
Base meterial, Solder Mask composition (PSR4000-AUS308)
Trade Secret
0.100
0.04%
0.15%
382
Talc (containing no asbest fibers)
Base meterial, Solder Mask composition (PSR4000-AUS308)
14807-96-6
0.700
0.27%
1.04%
2673
Barium Sulfate
Base meterial, Solder Mask composition (PSR4000-AUS308)
7727-43-7
5.000
1.91%
7.45%
19091
Silica
Base meterial, Solder Mask composition (PSR4000-AUS308)
Trade Secret
0.100
0.04%
0.15%
382
2-Benzyl-2dimethylamino-1-(4-morpholino-phenyl)-1-butanone
Base meterial, Solder Mask composition (PSR4000-AUS308)
119313-12-1
0.700
0.27%
1.04%
2673
Defoamers/leveling agent etc.
Base meterial, Solder Mask composition (PSR4000-AUS308)
Trade Secret
0.700
0.27%
1.04%
2673
Dipropyleneglycolmonomethylether
Base meterial, Solder Mask composition (PSR4000-AUS308)
34590-94-8
1.500
0.57%
2.24%
5727
3-methoxy-3-methylbutylacetate
Base meterial, Solder Mask composition (PSR4000-AUS308)
103429-90-9
2.900
1.11%
4.32%
11073
Heavy Aromatic Solvent naphtha
Base meterial, Solder Mask composition (PSR4000-AUS308)
64742-94-5
0.700
0.27%
1.04%
2673
Napthalence
Base meterial, Solder Mask composition (PSR4000-AUS308)
91-20-3
0.100
0.04%
0.15%
382
Acrylicestermonomer
Base meterial, Solder Mask composition (CA40-AUS308)
Trade Secret
2.900
1.11%
4.32%
11073
Epoxy resin
Base meterial, Solder Mask composition (CA40-AUS308)
Trade Secret
9.000
3.44%
13.41%
34364
Organic filler
Base meterial, Solder Mask composition (CA40-AUS308)
Trade Secret
0.700
0.27%
1.04%
2673
Barium Sulfate
Base meterial, Solder Mask composition (CA40-AUS308)
7727-43-7
5.400
2.06%
8.05%
20618
Dipropyleneglycolmonomethylether*)1-(2-methoxy-2-methylethoxy)-2-
propanol
Base meterial, Solder Mask composition (CA40-AUS308) 34590-94-8 1.400 0.53% 2.09% 5346
3-methoxy-3-methylbutylacetate
Base meterial, Solder Mask composition (CA40-AUS308)
103429-90-9
0.700
0.27%
1.04%
2673
Nickel
Surface treatment
7440-02-0
2.800
1.07%
4.17%
10691
Gold Potassium Cyanide
Surface treatment
13967-50-5
0.700
0.27%
1.04%
2673
100.00%
tin
7440-31-5
0.740
0.28%
87.00%
2824
surfactant
-
0.026
0.01%
3.00%
97
silver
7440-22-4
0.026
0.01%
3.00%
97
Alkoxylated alcohol.
-
0.026
0.01%
3.00%
97
Organic acid
-
0.026
0.01%
3.00%
97
2,2'-iminodiethanol
111-42-2
0.004
0.00%
0.50%
16
surfactant
-
0.004
0.00%
0.50%
16
100.00%
Barium titanate(IV)
12047-27-7
0.260
0.10%
81.25%
993
Nickel
7440-02-0
0.044
0.02%
13.75%
168
Copper
7440-50-8
0.008
0.00%
2.50%
31
Tin
7440-31-5
0.008
0.00%
2.50%
31
100.00%
Epoxy
29690-82-2
0.024
0.01%
20.00%
92
Acrylate copolymer
Trade secret
0.024
0.01%
20.00%
92
Hardener
Trade secret
0.012
0.00%
10.00%
46
Silica
7631-86-9
0.060
0.02%
50.00%
229
100.00%
Epoxy
29690-82-2
0.530
0.20%
20.00%
2024
Acrylate copolymer
Trade secret
0.530
0.20%
20.00%
2024
Hardener
Trade secret
0.265
0.10%
10.00%
1012
Silica
7631-86-9
1.325
0.51%
50.00%
5059
100.00%
Gold
Balance Material
7440-57-5
0.386
0.15%
99.99%
1474
Others
Trade secret
0.000
0.00%
0.01%
0.1
100.00%
Tin
Remain
7440-31-5
15.503
5.92%
96.50%
59193
Silver
Conductivity Improvement
7440-22-4
0.482
0.18%
3.00%
1840
Copper
Heat resistance improvement
7440-50-8
0.080
0.03%
0.50%
307
100.00%
Total 261.90 100.0% 1000000.0
DSH
0.3mm (Sn/3.0Ag/0.5Cu)
HP 0.8mil
Die Attach Material
(Tape 2)
INNOX
IDU0B3L-20T
Wire
LT Metal
Capacitor
TayoYuden
1uf/6.3V/X5R/C0603/0.3T
Die Attach Material
(Tape 1)
INNOX
IDU5C0-20T
Substrate
DDE
FBJS15304S 2H SU R.0
Solder paste
Alpha
WS693CPS
Material Declaration Sheet
Mold Compound
EM Networks
LMC705VF
Solder Ball
Adhesive materials for die to die, die to sub
UV Cure type dicing tape
Adhesive materials for die to die, die to sub
UV Cure type dicing tape
Principle component
Soldering
Alliance Memory Inc. 12815 NE 124th Street Suite D Kirkland, WA 98034 Tel: 425-898-4456
Fax: 425-896-8628 Alliance Memory Inc. reserves the right to change products or specification without notice