HJY ELECTRONIC CORP.
MP10005 thru MP1010
10.0 A Single-Phase Silicon Bridge Rectifier
Rectifier Reverse Voltage 50 to 1000V
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
Parameter Symbol unit
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at TA=55 C
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing ( t<8.3ms)
Typical thermal resistance per element (1)
Operating junction and storage temperature
range
Electrical Characteristics
Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.
For Capacitive load derate by 20 %.
Parameter Symbol Unit
Maximum instantaneous forward voltage drop
per leg at 5.0A
Maximum DC reverse current at rated TA =25 C
DC blocking voltage per element TA =125 C
VRRM
VRMS
VDC
IF(AV)
I t
2
IFSM
ReJA
TJ,
TSTG
VF
IR
50 100 200 400 800 1000600
35
70 140 280 420 560 700
50 100 200 400 600 800 1000
V
V
V
A
A
V
A
2
sec
MP
10005
MP
1001
MP
1002
MP
1004
MP
1006
MP
1008
MP
1010
MP
10005
MP
1001
MP
1002
MP
1004
MP
1006
MP
1008
MP
1010
A
C / W
Features
Mechanical Data
The plastic material used carries Underwriters Laboratory
flammability recognition 94V-0
Integrally molded heat sinks provide low thermal resistance
for maximum heat dissipation
Surge overload ratings to 300 amperes
High temperature soldering guaranteed 265 C/10
seconds at 5 lbs (2.3kg) tension
Case: Molded plastic with heat sink integrally mounted in the
bridge encapsulation
Terminals: Plated .25" (6.53mm) Faston
Mounting Position: Any
Weight: 0.706 ounce, 20 grams (approx)
Universal 4-way terminals, snap-on, wrap-around,
solder or P.C. Board mounting
Mounting Position: Bolt down on heat-sink with silicone thermal
compound between bridges and mounting surface for
maximum heat transfer efficiency
300
2.1
-55 to + 150
1.05
10
500
10
374
Hole for
# 10 Screw
DIA.
+
5.35
0.25
+
28.55 0.25
+
16.2
0.5
+
14.3
0.5
+
11.10 0.13
0.78
+
16.2
0.5
+
28.55 0.25
6.35
+
18.1
0.5
+
24.1
1.3
+
~
_
~
EPOXY CASE
WITH METAL HEAT SINK
Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting.
Dimensions in millimeters (1mm=0.0394＂）
2003 HJY ELECTRONIC CORP.
www.chinahjy.com
Rating and Characteristic Curves
MP10005 thru MP1010
Fig. 2 Maximum Non-repetitive Peak
Forward Surge Current
Fig. 3 Typical Instantaneous
Forward Characteristics
Fig. 4 Typical Reverse
Characteristics at Tj=25
C
o
( TA=25 Unless otherwise noted )
C
o
Peak Forward Surge Current,
Amperes
Instantaneous Forward Current,
Amperes
Instantaneous Reverse
Current ,Amperes
Number of Cycles at 60HZ
Instantaneous Forward
Voltage, Volts
Percent of Rated Peak Reverse
Voltage, %
40
100
200
300
400
1
10 100
.01
0.1
1.0
10
100
0.4 0.6 0.8 1.0
1.2 1.4
1.6
.01
0.1
1.0
10
0 20 40 60 80 100 120 140
Tj=25 C
Tj=100 C
8.3ms
Single half-sine-Wave
[JEDEC Method]
Tj=25 C
Pulse Width=300us
2% duty cycle
Fig. 1 Derating Curve for
Output Rectified Current
A
ve
r
a
ge
Fo
r
wa
rd
O
ut
p
ut
C
ur
re
n
t,
A
m
p
e
r
e
s
0
5
10
15
50 100 150
0
60Hz Resistive or
Inductive Load
Case Temperature, C
o
2003 HJY ELECTRONIC CORP.
www.chinahjy.com