HJY ELECTRONIC CORP.
MP10005W thru MP1010W
10.0 A Single-Phase Silicon Bridge Rectifier
Rectifier Reverse Voltage 50 to 1000V
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
Maximum average forward rectified
output current at TA=55 C
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
Rating for fusing ( t<8.3ms)
Typical thermal resistance per element (1)
Operating junction and storage temperature
range
Electrical Characteristics
Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.
For Capacitive load derate by 20 %.
Maximum instantaneous forward voltage drop
per leg at 5.0A
Maximum DC reverse current at rated TA =25 C
DC blocking voltage per element TA =125 C
VRRM
VRMS
VDC
IF(AV)
I t
2
IFSM
ReJA
TJ,
TSTG
VF
IR
50 100 200 400 800 1000
600
35
70 140 280 420 560 700
50 100 200 400 600 800 1000
V
V
V
A
A
V
10005W
1001W
1002W
1004W
1006W
1008W 1010W
10005W1001W
1002W
1004W 1006W 1008W 1010W
MP MP MP MP MP
MP MP
MP MP MP MP MP MP MP
A
2
sec
A
C / W
300
2.1
-55 to + 150
1.0
10
500
10
374
Features
Mechanical Data
The plastic material used carries Underwriters Laboratory
flammability recognition 94V-0
Integrally molded heat sinks provide low thermal resistance
for maximum heat dissipation
Surge overload ratings to 300 amperes
High temperature soldering guaranteed 265 C/10
seconds at 5 lbs (2.3kg) tension
Case: Molded plastic with heat sink integrally mounted in the
bridge encapsulation
Terminals: Plated copper leads .040" (1.02mm) diameter
Mounting Position: Any
Weight: 0.706 ounce, 20 grams (approx)
Universal 4-way terminals, snap-on, wrap-around,
solder or P.C. Board mounting
Mounting Position: Bolt down on heat-sink with silicone thermal
compound between bridges and mounting surface for
maximum heat transfer efficiency
Parameter Symbol
Parameter
Symbol
Hole for
# 10 Screw
DIA.
+
5.35
0.25
+
28.55 0.25
+
18.1
0.5
+
11.10 0.13
+
11.4
0.5
+
28.55 0.25
+
18.1
0.5
30.5
MIN.
+
1.02
0.05
+
~
_
~
EPOXY CASE
WITH METAL HEAT SINK
Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting.
Dimensions in millimeters (1mm=0.0394")
2003 HJY ELECTRONIC CORP.
www.chinahjy.com