Application Ready Platform with Ultra HD HDMI Input based on the Qualcomm® Snapdragon 820 Processor
Inforce 6620™ SBC
The Inforce 6620 platform is based on Qualcomms rst
custom 64 bit quad core Snapdragon 820 processor
(APQ8096) for embedded applications. It is a Turnkey
solution with rich set of I/Os to enable Streaming/
Mirroring/Control of high resolution UHD video content in
an optimized, reliable and secure digital environment.
The plug-and-play Inforce 6620 SBC comes in a compact
form factor with an optional fan-less plastic enclosure with
in-built thermal dissipation and enables a more connected
and immersive experience through its UHD HDMI input
and dual concurrent HDMI outputs.
The Inforce 6620 SBC is a production-ready platform that
will take your product to the next level, quickly and
competitively.
Application ready system with UHD HDMI Input
and dual concurrent displays
Analytics
Production-ready, with volume-conscious pricing
Media sharing Virtual/Augmented
Reality
Medical Imaging
Superior performance and eciency with
Qualcomm Kyro CPU
HDMI 4K Input with audio; Dual HDMI outputs with
audio; CEC and EDID negotiations
Vector eXtensions (HVX) on Hexagon680 DSP and
Adreno530 GPU, to support machine learning and
Ecient rendering of advanced 3D graphics
Extended lifecycle; OEM engagement options for BTO
and custom variants
Dedicated Technical Support from SMART TechWeb
Document Number: 003628 Rev B
Technical Specications
Processor
Qualcomm® Snapdragon 820 Quad Core (APQ8096 SoC)
Qualcomm® Kryo64-bit CPU @2.2GHz each
Qualcomm® Adreno 530 GPU
Qualcomm® HexagonDSP 680
Multimedia
HDMI v2.0 4K60 Ultra HD + HDMI v1.4a/b 1080p60 outputs
HDMI UltraHD input with audio
Ordering Info
Part Number Description
IFC6620-00-P1
Board Only with heat sink; Android OS
SYS6620-00-P1
BTO - IFC662000-P1 with plastic enclosure
Memory/ Storage
Connectivity
4GB LPDDR4
16GB eMMC
Bluetooth 4.2 via QCA6174A
Wi-Fi 802.11ac dual band 2.4GHz/5GHz via QCA6174A
2x USB 3.0; USB-C (USB HS)
Operating System
Android Nougat 7.1.1 board support package (BSP) pre-loaded
Other Specications
Power: +12V/5A; 802.3at PD compliant conguration for PoE
Size: 160mm x 80mm
Operating Temp: 0 to 50Celsius
Relative Humidity: 5 to 95% non-condensing
FCC Certied
RoHS and WEEE compliant
Global Sales & Support SMART Wireless Computing Inc. 39870 Eureka Dr, Newark, CA 94560 USA
Phone: (510) 623-1231 | Sales-wc@smartwirelesscompute.com
https://www.smartwirelesscompute.com
© 2021 SMART Wireless Computing, Inc. All rights reserved. All other trademarks and product information are the property of their respective owners.
©2021 SMART Wireless Computing, Inc. Specications subject to change without notice.
SMART Wireless Computing® is a supplier of application-ready embedded hardware platforms in eco-aware, low-prole footprints, available
o-the-shelf to serve growing markets enabled by the next generation of connected devices. At SMART, we are inspired by the inection point
in mobile and wireless technologies which is spawning innovative devices, content, and services. Together with silicon, software, and system
partners, SMART is pioneering products with an optimized delivery model for target markets such as connected cameras, connected displays
and connected tness.