CS20N50F A9R
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 1 of 10 2016V01
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Silicon N-Channel Power MOSFET
General Description：
CS20N50F A9R the silicon N-channel Enhanced
VDMOSFET, is obtained by the self-aligned planar Technology
which reduce the conduction loss, improve switching
performance and enhance the avalanche energy. The transistor
can be used in various power switching circuit for system
miniaturization and higher efficiency. The package form is
TO-220F, which accords with the RoHS standard.
Features：
Fast Switching
Low ON Resistance
(Rdso
n≤0.3
Ω)
Low Gate Charge (Typical Data:52nC)
Low Reverse transfer capacitances(Typical:16pF)
100% Single Pulse avalanche energy Test
Applications：
Power switch circuit of adaptor and charger.
Absolute（Tc= 25℃ unless otherwise specified）：
Symbol
Parameter
Rating
Units
V
DSS
Drain-to-Source Voltage
500
V
I
D
Continuous Drain Current
20
A
Continuous Drain Current T
C
= 100 °C
12.5
A
I
DM
a1
Pulsed Drain Current
80
A
V
GS
Gate-to-Source Voltage
±30
V
E
AS
a2
Single Pulse Avalanche Energy
1200
mJ
dv/dt
a3
Peak Diode Recovery dv/dt
5.0
V/ns
P
D
Power Dissipation
45
W
Derating Factor above 25°C
0.36
W/℃
T
J
，T
stg
Operating Junction and Storage Temperature Range
150，–55 to 150
℃
T
L
Maximum Temperature for Soldering
300
℃
V
DSS
500
V
I
D
20
A
P
D
(T
C
=25℃)
45
W
R
DS(ON)Typ
0.24
Ω
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 2 of 10 2016V01
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CS20N50F A9R
Electrical Characteristics（Tc= 25℃ unless otherwise specified）：
OFF Characteristics
Symbol
Parameter
Test Conditions
Rating
Unit
s
Min.
Typ.
Max.
V
DSS
Drain to Source Breakdown Voltage
V
GS
=0V, I
D
=250µA
500
--
--
V
ΔBV
DSS
/ΔT
J
Bvdss Temperature Coefficient
ID=250uA,Reference25℃
--
0.6
--
V/℃
I
DSS
Drain to Source Leakage Current
V
DS
=500V, V
GS
= 0V,
T
a
= 25℃
--
--
1
µA
V
DS
=400V, V
GS
= 0V,
T
a
= 125℃
--
--
100
µA
I
GSS(F)
Gate to Source Forward Leakage
V
GS
=+30V
--
--
100
nA
I
GSS(R)
Gate to Source Reverse Leakage
V
GS
=-30V
--
--
-100
nA
ON Characteristics
Symbol
Parameter
Test Conditions
Rating
Units
Min.
Typ.
Max.
R
DS(ON)
Drain-to -Source On-Resistance
V
GS
=10V,I
D
=10A
--
0.24
0.3
Ω
V
GS(TH)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250µA
2.0
--
4.0
V
Pulse width tp≤300µs,δ≤2%
Dynamic Characteristics
Symbol
Parameter
Test Conditions
Rating
Units
Min.
Typ.
Max.
g
fs
Forward Trans conductance
V
DS
=15V, I
D
=10A
--
18
--
S
C
iss
Input Capacitance
V
GS
= 0V V
DS
= 25V
f = 1.0MHz
--
2919
--
pF
C
oss
Output Capacitance
--
277
--
C
rss
Reverse Transfer Capacitance
--
16
--
Resistive Switching Characteristics
Symbol
Parameter
Test Conditions
Rating
Units
Min.
Typ.
Max.
t
d(ON)
Turn-on Delay Time
I
D
=20A V
DD
= 250V
R
G
=10Ω
--
34
--
ns
tr
Rise Time
--
65
--
t
d(OFF)
Turn-Off Delay Time
--
82
--
t
f
Fall Time
--
45
--
Q
g
Total Gate Charge
I
D
=20A V
DD
=400V
V
GS
= 10V
--
52
--
nC
Q
gs
Gate to Source Charge
--
12.6
--
Q
gd
Gate to Drain (“Miller”)Charge
--
18.6
--