Henkel’s LOCTITE
®
ECCOBOND DS LV and LOCTITE ECCOBOND EN are designed for reinforcement
of OLED, Chip-on-Glass (COG) and flexible printed circuit (FPC) module coating applications for LCDs.
Both materials deliver high-humidity reliability performance, can be cured with UV, visible or LED light,
and offer strong reinforcement even for OLED devices with large, thin screens. LOCTITE ECCOBOND DS
LV and LOCTITE ECCOBOND EN are halogen-free materials with high flexibility to support
bending and folding. Low water vapor transmission rates (WVTR) provide good barrier protection. The
combination of reliability and flexibility enables manufacturers to realize high-yield, cost-effective
production for profitable results.
FPC REINFORCEMENT MATERIALS
LOCTITE
®
ECCOBOND DS LV AND LOCTITE
®
ECCOBOND EN
Except as otherwise noted, all marks used are trademarks and/or registered trademarks of Henkel and/or its aliates in the U.S. and elsewhere.
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PRODUCT PROPERTIES
PRODUCT LOCTITE ECCOBOND DS LV LOCTITE ECCOBOND EN
DESCRIPTION
High-reliability, highly flexible reinforcement
material
Low modulus, fast UV-cure version of
LOCTITE ECCOBOND DS LV
TYPICAL APPLICATION
COG, FPC, and panel reinforcement COG, FPC, and panel reinforcement
PROPERTIES
BEFORE CURE
APPEARANCE
Light yellow, transparent liquid Light yellow
VISCOSITY AT s
-1
(cP)
PROPERTIES
AFTER CURE
GLASS TRANSITION TEMPERATURE, T
g
(°C)
TENSILE MODULUS MPa)
ELONGATION AT BREAK
WATER VAPOR TRANSMISSION RATE,
WVTR, AT . mm THICK g/[m
·day])
SOD
IUM AND CHLORIDE ION IMPURITY
(ppm)
P
EEL STRENGTH ON POLYIMIDE
SUBSTRATE N/cm)
.
• Fast cure
• Low viscosity
• High adhesion to polyimide and glass
• Good moisture resistance
• Excellent flexibility with high elongation
capabilities
KEY BENEFITS