Technical Data Sheet
BERGQUIST GAP FILLER TGF 1100SF
Known as BERGQUIST GAP FILLER 1100SF
June-2019
PRODUCT DESCRIPTION
Thermally Conductive, Silicone-Free Gap Filling Material.
Technology Silicone free
Appearance (cured) Orange
Appearance - Part A Yellow
Appearance - Part B Red
Cure Room temperature cure or Cure at
elevated temperatures
Application Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight:
Part A: Part B
1 : 1
Mix Ratio by volume:
Part A: Part B
1 : 1
Solids Content, % 100
Operating Temperature
Range
-60 to 125ºC
FEATURES AND BENEFITS
● Thermal Conductivity: 1.1 W/m-K
● No silicone outgassing or extraction
● Ultra-conforming, designed for fragile and low-stress
applications
● Ambient and accelerated cure schedules
● 100% solids - no cure by-products
BERGQUIST GAP FILLER TGF 1100SF is a high
performance, thermally conductive liquid gap filling material
whichexhibits low modulus properties then cures to a
soft,flexible eastomer, helping reduce thermal cycling stresses
during operation and virtually eliminating stress during
assembly of low-stress applications.
The mixed system will cure at ambient. BERGQUIST GAP
FILLER TGF 1100SF offers infinite thickness variations with
little or no stress to the sensitive components during or
following assembly. BERGQUIST GAP FILLER TGF 1100SF is
not intended for use in thermal interface applications requiring
a mechanical structural bond.
TYPICAL APPLICATIONS
● Hard disk assemblies
● Silicone-sensitive electronics
● Filling various gaps between heat-generating devices to
heat sink and housing
● Mechanical switching relay
● Silicone-sensitive optic components
● Dielectric for bare-leaded devices
TYPICAL PROPERTIES OF UNCURED MATERIAL
The viscosity of the BERGQUIST GAP FILLER TGF 1100SF
material is temperature dependent. The table below provides
the multiplication factor to obtain viscosity at various
temperatures. To obtain the viscosity at a given temperature,
look up the multiplication factor at that temperature and
multiply the corresponding viscosity at 25°C.
TYPICAL UNCURED PROPERTIES
Part A Properties
Viscosity @ 20 °C 1.43
Viscosity @ 25 °C 1.0
Viscosity @ 35 °C 0.58
Viscosity @ 45 °C 0.39
Viscosity @ 50 °C 0.32
Part B Properties
Viscosity @ 20 °C 1.57
Viscosity @ 25 °C 1.0
Viscosity @ 35 °C 0.5
Viscosity @ 45 °C 0.3
Viscosity @ 50 °C 0.24
Mixed Properties
Mixed Viscosity, Brookfield RV, Helipath, 25 °C, mPa·s
(cP):
Spindle TF, speed 2 rpm 450,000
Density, ASTM D792, g/cc 2.0
Pot Life @ 25 °C (time to double viscosity), minutes:
GAP FILLER TGF 1100SF-15 (Fast cure) 15
GAP FILLER TGF 1100SF-240 (Slow cure) 240
Shelf Life @ 25ºC , days 180
TYPICAL CURE SCHEDULE
BERGQUIST GAP FILLER TGF 1100SF is available with
different curing characteristics to better suit your process.
BERGQUIST GAP FILLER TGF 1100SF-15 reacts and cures
faster than BERGQUIST GAP FILLER TGF 1100SF-240.
BERGQUIST GAP FILLER TGF 1100SF-240 has a longer
work life compared to BERGQUIST GAP FILLER TGF
1100SF-15.
TDS BERGQUIST GAP FILLER TGF 1100SF, June-2019
The following lists both work and cure time for the two
versions:
Typical Work Life
GAP FILLER TGF 1100SF-15, minutes 15
GAP FILLER TGF 1100SF-240, minutes 240
Typical Cure Time
GAP FILLER TGF 1100SF-15:
@ 25 °C, hours 3
@ 100°C, minutes 20
GAP FILLER TGF 1100SF-240:
@ 25 °C, hours 24
@ 100°C, minutes 120
Parallel plate rheometer, estimated time to read 90% cure.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240
60
Heat Capacity, ASTM E1269, J/g-K 0.9
Flammability, UL 94 V-0
Electrical Properties
Dielectric Strength, ASTM D149, V/mil 400
Dielectric Constant , ASTM D150 @ 1,000 Hz 5.0
Volume Resistivity, ASTM D257, ohm-cm 1×10
10
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 1.1
GENERAL INFORMATION
For safe handling information on this product, consult the
Safety Data Sheet, (SDS).
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
CONFIGURATIONS AVAILABLE
BERGQUIST GAP FILLER TGF 1100SF is available in the
following configurations:
● Cartridges
● Kits
Application:
● Mixed and dispensed using dual tube cartridge packs with
static mixers and a manual or pneumatic gun
● Mixed and dispensed using industry standard high volume
mixing and dispensing document
● Application of heat may be used to reduce viscosity
STORAGE
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 5 to 25ºC for a 6 month shelf life, in sealed
containers with moisture barrier packaging.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb/F
N/mm x 5.71 = lb/in
psi x 145 = N/mm²
MPa = N/mm²
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Americas
+1.888.943.6535
Europe
+32.1457.5611
Asia
+86.21.3898.4800
For the most direct access to local sales and technical support visit: www.henkel.com/electronics