BERGQUIST
®
GAP PAD
®
TGP 6000ULM
SILICONE GAP FILLING MATERIAL
For over years, the BERGQUIST
®
brand has been the trusted leader in thermal management with technology
platforms that deliver proven reliability for challenging applications. In keeping with its ongoing innovation
initiatives, Henkel has brought to market the latest in the BERGQUIST
®
GAP PAD
®
family. For applications where
high heat dissipation and low stress are required, Henkel has developed BERGQUIST
®
GAP PAD
®
TGP ULM.
Ideal for specific devices and systems in the power, computing, consumer, telecom and automotive sectors,
BERGQUIST
®
GAP PAD
®
TGP ULM oers high thermal conductivity of . W/mK and an ultra-low modulus
for reduced stress, particularly for small footprint components with high power density. The silicone-based, non-
electrically conductive GAP PAD
®
is highly conformable, providing excellent coverage on various topographies.
BERGQUIST
®
GAP PAD
®
TGP ULM is easy to apply and reworkable, as the material provides a low- and a
high-tack side and is available in custom-cut shapes for specific device and application requirements.
All marks used above are trademarks and/or registered trademarks of Henkel and its aliates in the U.S., Germany and elsewhere.
© Henkel Corporation. All rights reserved. LT- (/) US
PROPERTIES BERGQUIST
®
GAP PAD
®
TGP 6000ULM
Physical Properties Young’s Modulus (kPa)
.
Thermal Properties
Thermal Conductivity (W/mK)
Thermal Impedance, 30% Deflection
(°Cin
2
/W)
.
Electrical Properties
Dielectric Strength (VAC)
,
Volume Resistivity (Ωm)
x
Safety Testing Flammability Rating
UL V
Across the Board,
Around the Globe.
henkel-adhesives.com/thermal
Henkel Corporation
West th Street
Chanhassen, MN
United States
...
Key Benefits
• Outstanding thermal performance
• Very low stress
• Ease of handling
• High-tack and low-tack sides
• Reworkable
• Excellent wet-out characteristics
• High dielectric strength