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For Immediate Release
Amphenol TCS Launches Backplane Design Web Portal
DesignLink® Features Interactive Tools to Help OEMs Accelerate Backplane Designs
Nashua, New Hampshire – March 25, 2008 – Amphenol TCS, the leading provider of high
performance backplane interconnect systems, today announced the launch of its DesignLink® web
portal. The secure Internet portal delivers a custom suite of proprietary engineering design tools
and technical information specific to high-speed backplane design.
Amphenol TCS’s DesignLink portal was created to assist OEM system designers meet
demanding requirements for improved performance, reduced entry costs, and faster time to
market. The site features a set of unique, interactive design tools that allow designers to perform
trade-off analysis at any phase of a backplane design cycle, thereby saving costly prototype
spins and speeding their systems to market.
To create the DesignLink Portal, a team of Amphenol TCS engineers interviewed dozens of
customers and industry experts. “We asked engineers to describe the obstacles they
encountered during a new product design cycle and collected hundreds of requirements from
that process,” said Chris Heard, Hardware System Architect for Amphenol TCS. “The result is a
set of tools and information that can reduce engineering headaches early in the design process.”
Registered users can download in-depth technical documentation, such as application notes,
schematic symbols and pcb footprints, drawings, signal integrity reports, and mechanical
models for Amphenol TCS’s connector platforms, including XCede®, eHSD®, GbX®, VHDM®,
NeXLev®, and Ventura®.