I S O 9 0 0 1 : 2 0 1 5 R E G I S T E R E D

www.niccomp.com | technical support: tpmg@niccomp.com

Date: September 2020

RE: Reflow Soldering Heat

The below NIC product series table includes the NIC Components product series which meet the

reflow soldering requirements of IPC/JEDEC J-STD-020E

NIC SERIES

 3-Times reflow maximum

 +260°C Reflow Peak for 10 seconds

 150 seconds maximum above +217°C

 40 seconds maximum above +245°C

 Ramp up (heat) rate of 3°C/second

 Ramp down (cool) rate of 6°C/second

 Do not force cooling

NCLP

NCLS

NCSA

NCSP

NCSR

NCSS

NCST

NCST-A

NCSW

NFR

NRC

NRCA

NRC-AS

NRCE

NRCL

NRCP

NRCPH

NRCPS

NRC-S

NRCV

NRCW

NRSN

NRSNE

NRSNL

NRSNS

NTR

NTRA

NTRC

NTRH

Prepared by NIC TPMG Department / tpmg@niccomp.com

DOC: NIC-ChipR-Reflow-Sept2020-Rev2