R5528Z Series Reliability Test Report
305528ZFD -Ver. Aa
FUNCTION
： 3A Load Switch IC
： WLCSP-9-P1 … Lead free-solder ball (Sn-3.0Ag-0.5Cu), Halogen free resin
(*)PRE-
CONDITION
No
(1)+(2)
No
No
(1)+(2)
(1)+(2)
(1)+(2)
(1)+(2)
(1)
No
No
No
No
Pre-Condition
The test shall be performed this
pre-condition before testing.
(1) Ta=85℃, RH=85%, storage=168h
(2) IR Reflow soldering heat stress (3times)
[Moisture Sensitivity Level]
MSL Level = 1 (J-STD-020)
Conclusion : The reliability result was good.
Once
0/11
The electrical characteristics prescribed in the individual specifications shall be satisfied.
12
13
Criteria :
*）
Latch-up
CDM ±1.0kV
7
8
9
10
11
ESD(2)
MM C=200pF R=0 ohm ±200V
ESD(1)
IR Reflow (See Fig.1)
3
4
5
6
2
3times
0/11
ESD(3)
HBM C=100pF R=1.5k ohm ±2.0kV
Once
0/11
5times
0/11
USPCT
Ta=125℃ RH=85% 2X10
5
Pa
100h
0/11
Resistance To Soldering
Heat
3times
0/88
100cycles
0/11
USPCBT
Ta=125℃ RH=85% 2X10
5
Pa VDD=Vopt max. Static
100h
0/11
0/22
Temp. Humidity
Ta=85℃ RH=85%
1000h
0/22
0/22
High Temp. Storage
Ta=150℃
1000h
0/22
0/32
TEST ITEM
TEST CONDITION
TIME
r/n
Pulse Current Injecting Method ±100mA
PACKAGE
No.
1
High Temp. Operating Life
Ta=125℃ VDD=Vopt max. Static
1000h
Temp. Humidity Bias
Ta=85℃ RH=85% VDD=Vopt max. Static
1000h
Low Temp. Storage
Ta=-65℃
1000h
Temp. Cycle
Ta=-65 to 150℃ (30-30min)
Nisshinbo Micro Devices Inc.