Technical Data Sheet
BERGQUIST GAP FILLER TGF 2000
Known as BERGQUIST GAP FILLER 2000
October -2018
PRODUCT DESCRIPTION
A thermally conductive, liquid gap filler material.
Technology Silicone
Appearance (cured) Pink
Appearance - Part A Pink
Appearance - Part B White
Cure Room temperature cure or Heat cure
Application Thermal management,
TIM (Thermal Interface Material)
Mix Ratio by weight:
Part A: Part B
1 : 1
Mix Ratio by volume:
Part A: Part B
1 : 1
Solids Content, % 100
Operating Temperature
Range
-60 to 200ºC
FEATURES AND BENEFITS
● Thermal Conductivity: 2.0 W/m-K
● Ultra-conforming, designed for fragile and low-stress
applications
● Ambient and accelerated cure schedules
● 100% solids - no cure by-products
● Excellent low and high temperature mechanical and
chemical stability
BERGQUIST GAP FILLER TGF 2000 is a high performance,
thermally conductive, liquid gap filling material supplied as a
two-component, room or elevated temperature curing system.
The material provides a balance of cured material properties
and good compression set (memory). The result is a soft,
thermally conductive, form-in-place elastomer ideal for
coupling “hot” electronic components mounted on PC boards
with an adjacent metal case or heat sink. Before cure,
BERGQUIST GAP FILLER TGF 2000 flows under pressure
like a grease. After cure, it does not pump from the interface as
a result of thermal cycling and is dry to the touch.
Unlike cured Gap Filling materials, the liquid approach offers
infinite thickness with little or no stress during displacement
and assembly. BERGQUIST GAP FILLER TGF 2000
eliminates the need for specific pad thickness and die-cut
shapes for individual applications.
BERGQUIST GAP FILLER TGF 2000 is intended for use in
thermal interface applications when a strong structural bond is
not required. As cured, BERGQUIST GAP FILLER TGF 2000
is formulated to have pliable low-modulus, properties.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Telecommunications
● Computer and peripherals
● Thermally conductive vibration dampening
● Between any heat-generating semiconductor and a heat
sink
TYPICAL PROPERTIES OF UNCURED MATERIAL
Mixed Viscosity, Brookfield - RV, - Helipath, ASTM D2196,
25 °C, mPa·s (cP):
Spindle TF, speed 20 rpm 300,000
Density, ASTM D792, g/cc 2.9
Pot Life @ 25ºC , time for viscosity to double:
@ 15 minutes
@ 60 minutes
@ 600 minutes
Shelf Life @ 25ºC , days 180
TYPICAL CURE SCHEDULE
Cure Schedule
1 to 2 hours @ 25°C
5 minutes @ 100°C
Alternative Cure Schedule 1
3 to 4 hours @ 25°C
15 minutes @ 100°C
Alternative Cure Schedule 2
3 days @ 25°C
1 hour @ 100°C
Rheometer - time to read 90% cure.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Hardness, Shore 00, Thirty second delay value,
ASTM D2240
70
Heat Capacity, ASTM D1269, J/g-K 1.0
Flammability, UL 94 V-0
Electrical Properties
Dielectric Strength, ASTM D149, V/mil 500
Dielectric Constant , ASTM D150 @ 1,000 Hz 7
Volume Resistivity, ASTM D257, ohm-meter 1×10
11
TDS BERGQUIST GAP FILLER TGF 2000, October -2018
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K) 2.0
GENERAL INFORMATION
For safe handling information on this product, consult the Safety
Data Sheet, (SDS).
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
The above cure profiles are guideline recommendations. Cure
conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures.
CONFIGURATIONS AVAILABLE
BERGQUIST GAP FILLER TGF 2000 is available in the
following configurations:
● Cartridges
● Kits
STORAGE
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 5 to 25ºC for a 6 month shelf life, in sealed
containers with moisture barrier packaging.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb/F
N/mm x 5.71 = lb/in
psi x 145 = N/mm²
MPa = N/mm²
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing, Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits. The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage: [Except as otherwise noted] All trademarks in this document
are trademarks and/or registered trademarks of Henkel and its affiliates in the
U.S. and elsewhere.
Reference 3
Americas
+1.888.943.6535
Europe
+32.1457.5611
Asia
+86.21.2891.8000
For the most direct access to local sales and technical support visit: www.henkel.com/electronics