Wire Material Cost Savings Cu Versus Au
Cu wire oers signicant cost advantage over Au wire. It is also
an excellent replacement for Au wire due to its similar electrical
properties. Self-inductance and self-capacitance are nearly the
same for Au and Cu wire and Cu wire has lower resistivity. In
applications where resistance due to bond wire can negatively
impact circuit performance, using Cu wire can oer improvement.
Copper Wirebonding
TECHNOLOGY SOLUTIONS
Package Family Cu Wire HVM Plant
CABGA C3, K4, P3, ATJ
fcCSP C3
LQFP P1, ATJ
MicroLeadFrame
®
(QFN) C3, K4, P1, P3
MQFP P1, T1
PBGA K4, P3
PDIP, PLCC P1
Package-on-Package (PoP) K4
PSOP P1
SBGA K4
SC70 P1
SCSP C3, K4, ATJ
System in Package (SiP) K4
SOIC P1
SO8-FL M1
SOT-23 P1
SSOP P1
TQFP P1, ATJ
TSSOP P1
TSON, TOLL M1
Cu-Alloy Wire Readiness
Wire diameter (mil)
COPPER WIRE BENEFITS
Cu wire has long been used as a
method of connecting a silicon die
to the package terminals. With the
recent increase in gold (Au) wire
cost, Cu wire is an attractive way to
manage overall package cost.
f Increasing cost of Au is driving the
need to use lower cost Cu wire
f Copper is an attractive replacement
material for Au because of good
electrical & thermal performance
f Amkor has a long & wide history of Cu
wire process
▷ 20+ years of experience
(development to HVM)
▷ Qualied on 0.6-2.0 mils diameter
Cu wire
f Mass production on both leadframe &
laminate products
f Cu wire is supported in all Amkor
worldwide factories with mass
production since 2006
f Amkor worldwide Cu wire BOM/BKMs
established
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such
information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not
in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor
reserves the right to make changes in its product and specications at any time and without notice. The Amkor name and logo are
registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.
© 2021 Amkor Technology, Incorporated. All Rights Reserved. TS105G-EN Rev Date: 01/21
Visit amkor.com or email sales@amkor.com for more information.
Copper Wirebonding
Wire Dia
(µm)
Current Carrying Capacity (Amps) 3D Electrical Parasitic Parameters
Wire Length > 40 mil (1 mm) Wire Length = 40 mil (1 mm)
Wire Type R11 (mΩ) @ 1 GHz C11 (pF) L11 (nH)
Au Wire
(4-9’s)
Au Wire
(3-9’s)
Au Wire
(2-9’s)
Cu Wire
(4-9’s)
Au Wire Cu Wire Au Wire Cu Wire Au Wire Cu Wire
51 1.83 1.81 1.61 1.83 73.9 62.2 0.119 0.119 0.515 0.515
25 0.63 0.62 0.55 0.63 144.4 116 0.081 0.081 0.69 0.677
23 0.56 0.55 0.49 0.56 154.1 128.7 0.078 0.078 0.707 0.687
20 0.45 0.45 0.4 0.45 172.9 145 0.075 0.075 0.728 0.724
18 0.39 0.38 0.34 0.39 196.3 163.2 0.071 0.071 0.76 0.751
15 0.29 0.29 0.26 0.29 234.3 194.7 0.067 0.067 0.811 0.801
Resistivity
(µohm-cm)
2.3 2.5 3 1.7
x
>60 nm 55/60 nm 45/40 nm 28 nm <28 nm
Non-Low-k Or Low-k Low-k Low-k Ultra Low-k Ultra Low-k Ultra Low-k
Reliability Status Customer Qualied Customer Qualied Customer Qualied Customer Qualied In Process
Production Status HVM HVM HVM HVM Development
Minimum Bond Pad Size By Wire Diameter (T = Bond Pad Metal Thickness)
0.7 ≤ T ≤ 1.5 µm 1.5 ≤ T ≤ 2.5 µm 2.6 ≤ T ≤ 4.0 µm
FWD SSB FWD SSB FWD SSB
BPO BPP BPO BPP BPO BPP BPO BPP BPO BPP BPO BPP
Recommended
Wire
15 µm ≥35 ≥40 ≥41 ≥48 ≥37 ≥42 ≥46 ≥51 ≥39 ≥44 ≥48 ≥53
18 µm ≥40 ≥45 ≥47 ≥54 ≥42 ≥47 ≥52 ≥57 ≥44 ≥49 ≥54 ≥59
20 µm ≥44 ≥50 ≥51 ≥59 ≥46 ≥52 ≥56 ≥62 ≥48 ≥54 ≥58 ≥64
23 µm ≥52 ≥58 ≥59 ≥67 ≥54 ≥60 ≥64 ≥70 ≥56 ≥62 ≥66 ≥72
25 µm ≥56 ≥62 ≥66 ≥72 ≥58 ≥64 ≥69 ≥75 ≥60 ≥66 ≥71 ≥77
Minimum
Wire
15 µm ≥34 ≥38 ≥39 ≥46 ≥36 ≥40 ≥43 ≥48 ≥37 ≥41 ≥45 ≥50
18 µm ≥39 ≥43 ≥45 ≥52 ≥41 ≥45 ≥49 ≥54 ≥42 ≥46 ≥51 ≥56
20 µm ≥43 ≥47 ≥49 ≥56 ≥45 ≥49 ≥53 ≥58 ≥46 ≥50 ≥55 ≥60
23 µm ≥51 ≥55 ≥57 ≥64 ≥52 ≥56 ≥61 ≥66 ≥54 ≥58 ≥63 ≥68
25 µm ≥55 ≥59 ≥64 ≥69 ≥56 ≥60 ≥66 ≥71 ≥58 ≥62 ≥68 ≥73
Minimum Bond Pad Size By Wire Diameter (T = Bond Pad Metal Thickness)