J-Devices has extensive experience in copper wire products dating
back to 2007, resulting in mature and capable copper wire bonding
capability. J-Devices’ copper wire products have excellent quality
and reliability on par with gold wire. Customers receive the same or
better quality, reliability and electrical performance at an attractive
price.
Copper Wirebonding
TECHNOLOGY SOLUTIONS
Package Family Wire Diameter
QFN 18, 20, 25, 30 μm
LQFP 18, 20, 23, 30 μm
FBGA 15, 18, 20, 23 μm
PBGA 18, 20, 23 μm
HZIP 35, 50 μm
Package Family and Wire Diameter
Wafer Technology
Node
>65 nm 65/55 nm 40/32 nm 28 nm
Non-Low-k or Low-k Low-k Low-k Ultra Low-k Ultra Low-k
Reliability Status
Customer
Qualied
Customer
Qualied
Customer
Qualied
Customer
Qualied
Production Status HVM HVM HVM HVM
Wafer Technology Node and Cu Wire Readiness
Wire
Diameter (μm)
1.0 ≤ T ≤ 1.5 μm 1.6 ≤ T ≤ 2.0 μm 2.1 ≤ T ≤ 3.0 μm
BPO BPP BPO BPP BPO BPP
Recommended
13 >33 >40 >38 >45 >38 >45
15 >38 >45 >38 >45 >43 >50
18 >38 >45 >43 >50 >53 >60
20 >53 >60 >64 >80 >64 >80
Minimum Bond Pad Size by Wire Diameter
(T = Bond Pad Metal Thickness)
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such
information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of
whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not
in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor
reserves the right to make changes in its product and specications at any time and without notice. The Amkor name and logo are
registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies.
© 2018 Amkor Technology Incorporated. All Rights Reserved. TSJD404B Rev Date: 10/18
Visit amkor.com or email sales@amkor.com for more information.
Copper Wirebonding
Evaluation
Catagory
FBGA 121-pin/6 mm Pkg
Pad Pitch: 45 μm
Cu Wire (PCC) φ18 μm
FBGA 177-pin/13 mm Pkg
Pad Pitch: 45 μm
Cu Wire (PCC) φ18 μm
LQFP 100-pin/14 mm Pkg
Pad Pitch: 60 μm
CuWire (PCC) φ20 μm
Conditions # Failure Conditions # Failure Conditions # Failure
MSL JEDEC Level 3 JEDEC Level 3 JEDEC Level 3
TC
-65/175°C
0/231 pcs
(3 Lot)
-55/125°C
0/165 pcs
(3 Lot)
-65/175°C
0/231 pcs
(3 Lot)
500 cycles 500 cycles 500 cycles
HTSL
150°C
0/45 pcs
(1 Lot)
150°C
0/100 pcs
(3 Lot)
150°C
0/45 pcs
(1 Lot)
2000 hours 1000 hours 2000 hours
175°C
0/45 pcs
(1 Lot)
175°C
0/45 pcs
(1 Lot)
1000 hours 1000 hours
HAST
110°C/85%/Bias
0/231 pcs
(3 Lot)
110°C/85%/Bias
0/231 pcs
(3 Lot)
264 hours 264 hours
PCT
121°C/2.0 atm/100%
0/231 pcs
(3 Lot)
110°C/1.2 atm/85%
0/165 pcs
(3 Lot)
121°C/2.0 atm/100%
0/231 pcs
(3 Lot)
96 hours 500 hours 96 hours
THB
85°C/85%/bias
0/100 pcs
(3 Lot)
1000 hours
Wafer Technology Node and Cu Wire Readiness
Wire Diameter
(μm)
3D Electrical Parasitic Parameters
Wire Length = 1 mm
R11 (mΩ) @ 1 GHz C11 (pF) L11 (nH)
Au wire Cu wire Au wire Cu wire Au wire Cu wire
50 78.7 67.2 0.125 0.125 0.523 0.523
30 116.7 99.3 0.091 0.091 0.632 0.632
25 136.8 116.1 0.083 0.083 0.668 0.668
25 166.9 141.4 0.076 0.076 0.716 0.716
18 184.0 155.8 0.072 0.072 0.736 0.736
15 218.6 184.9 0.068 0.068 0.773 0.773
13 250.9 212.0 0.064 0.064 0.802 0.802