Leaders in Next Generation Package Design
Design Center
Provide
Design
Information
Complete
Preliminary
Design
Customer
Amkor
Electrical/
Thermal/
Mechanical
Simulation
Design
Revision
Electrical/
Thermal/
Mechanical
Simulation
Design
Revision
Electrical/
Thermal/
Mechanical
Simulation
Design
Revision
Design
Approved
Electrical/
Thermal/
Mechanical
Simulation
Provide Design Information
AND Electrical/Thermal/
Mechanical Requirements
Interactive Design AND
Simulation
Meet
Requirements?
Design Verication/
Simulation/Sign-O
Design
Approved
YES
NO
Driving Advanced Semiconductor Package Design
Amkor’s design engineers are trained experts and are
experienced in the latest design tools and packaging
technology. This allows our World Class Design Centers to
reduce design cycle times and provide expert advice and
service to our customers.
Amkor plays a leading role in supporting customers in
the development of next generation package design for
existing and emerging products. We process thousands of
new designs for our customers every year. As a result, we
have an unparalleled level of package design expertise and
can provide World Class leadframe, laminate or wafer level
design services, including:
f Highly trained and experienced design sta
f Quality, reliable and cost eective designs
f Design for Performance (DFP), Design for Manufacturing
(DFM) and Design for Cost (DFC)
f Customer assistance to meet thermal, electrical and
mechanical requirements
Design For Performance (DFP)
Co-Design for Reduced Cycle Time
Amkor has developed an interactive design optimization method (co-design) that helps reduce overall cycle time. Our fully
integrated design and simulation teams work together to meet our customers’ most stringent performance requirements.
Whether a simple simulation or an extensive engineering analysis is needed, Amkor’s design teams are here to help meet or
exceed customers design requirements and expectations.
Antiquated Design Process
Advanced Co-Design Process
Semiconductor IC Package
Design Services