ES1AL THRU ES1JL
Surface Mount Super Fast Rectifiers
Version: 6.1 www.jgdsemi.com
* Glass junction device
* Ideal for surface mou ted appl icat ion s
* Low reverse leakage
* Metallurgically bonded construction
* High temperature soldering guaranteed:
260℃/10 seconds
Package Outline Dimensions in inches (millim e ters)
SOD-123F
DIM.
Unit(mm) Unit(inch)
Min Max Min Max
A 3.50 3.90 0.138 0.154
B 1.70 1.90 0.067 0.075
C 2.60 2.90 0.102 0.114
D 0.80 1.10 0.031 0.043
E 0.88 1.08 0.035 0.043
F 0.10 0.20 0.004 0.008
G 0.70 0.90 0.028 0.035
* JEDEC SOD-123F molded plastic body over passivated
chip
* Terminals: Sol derab le per M IL-STD-750, Method 2026
* Polarity:
Color band den ote s cath ode end
* Mounting Pos ition: Any
Maximum Ratings and El ect rical Charact eristics
Rating at 25 ℃ ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capaci tive load, derate current by 20%.
Maximum Repetitive Peak Reverse Vol t age
Maximu m D.C Blo cking Voltage
Maximum Average Forward Rectified Current I
F(AV)
1.0 A
Peak Forward Surge Current, 8.3ms singl e half
I
FSM
30 A
Maximum Instant aneous Forward Volt age at 1. 0A V
F
0.95 1.25 1.7 V
Maximum reverse current @ rated VR T
J
=25℃
℃
I
R
1.0
μA
Maximum reverse recovery time (Note 1) Trr 35 nS
Typical Junction Capacitance(Note2) C
J
10 pF
Typical Thermal Resistance(Note3) R
θjL
40 ℃/W
Operating Junction and Storage Temperature
T
J
/T
STG
-55 to +150 ℃
NOTE : 1 、Measured with IF=0.5A, IR=1A, Irr=0.25A.. 2、Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3、PCB mounted on 0.2×0.2" (5.0×5.0mm) coppeer pad area.