TAI-TECH
P 1
leadframe
non-leadframe
1. Features
2. Applications
3. Dimensions
A
B
C
E
4R7
2009H
A`
D
A
B
C
E
D
R68
2009H
A`
4. Part Numbering
SMD Power Inductor
TMHC1004SV-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency.
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200
8. Operating temperature -55~+155℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
Halogen-free
Halogen
TMHC
1004
SV
-
4R7
MN
- D
A
B
C
D
E
F
A: Series
B: Dimension BxC
C: Type Standard.V: Vehicle
D: Inductance 4R7=4.70uH
E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
F: Code Marking: Black.4R7 and 2009H (20:YY, 09:WW, follow production date, H:P/N).
Recommend PC Board Pattern
L
G
H
Series
A
A`
B
C
D
E
TMHC1004SV
11.0±0.3
10.0±0.3
10.0±0.3
3.8±0.2
2.0±0.3
See spec
table
Unit:mm
L(mm)
G(mm)
H(mm)
12.5
5.4
3.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
TAI-TECH
P 2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
I rms.(A)
Saturation
Current DC
I sat. (A)
DCR
(mΩ)Typ
DCR
(mΩ)Max
E(mm)
±0.3
Type
Typ
Max
Typ
Max
TMHC1004SV-R15MN-D
0.15
45.0
40.0
80.0
70.0
0.50
0.60
3.0
non-leadframe
TMHC1004SV-R22MN-D
0.22
40.0
37.0
75.0
65.0
0.80
1.00
3.0
non-leadframe
TMHC1004SV-R33MN-D
0.33
38.0
35.0
70.0
60.0
1.00
1.20
3.0
non-leadframe
TMHC1004SV-R36MN-D
0.36
36.0
33.0
60.0
52.0
1.05
1.20
3.0
non-leadframe
TMHC1004SV-R47MN-D
0.47
31.0
28.0
48.0
43.0
1.30
1.50
3.0
non-leadframe
TMHC1004SV-R68MN-D
0.68
24.0
22.0
45.0
40.0
2.30
2.70
2.5
non-leadframe
TMHC1004SV-1R0MN-D
1.00
20.0
18.0
39.0
36.0
3.50
4.00
3.0
leadframe
TMHC1004SV-1R5MN-D
1.50
18.0
16.0
35.0
33.0
4.70
5.30
3.0
leadframe
TMHC1004SV-2R2MN-D
2.20
15.0
13.0
27.0
24.0
6.50
7.20
3.0
leadframe
TMHC1004SV-3R3MN-D
3.30
14.0
11.0
22.0
19.0
10.8
11.8
3.0
leadframe
TMHC1004SV-4R7MN-D
4.70
13.0
10.5
20.0
18.0
14.5
15.5
3.0
leadframe
TMHC1004SV-5R6MN-D
5.60
12.0
10.0
16.0
14.0
18.0
19.3
3.0
leadframe
TMHC1004SV-6R8MN-D
6.80
10.0
9.00
15.0
13.5
19.0
23.3
3.0
leadframe
TMHC1004SV-8R2MN-D
8.20
9.00
8.00
13.5
12.5
20.0
22.5
3.0
leadframe
TMHC1004SV-100MN-D
10.0
8.50
7.50
12.5
11.0
29.0
32.0
3.0
leadframe
TMHC1004SV-150MN-D
15.0
6.30
6.00
10.0
8.00
40.0
45.0
3.0
leadframe
TMHC1004SV-220MN-D
22.0
5.20
4.60
7.50
6.50
62.0
74.0
3.0
leadframe
TMHC1004SV-330MN-D
33.0
4.00
3.50
6.00
5.00
94.0
112
3.0
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δ
T of 40
℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.