TAI-TECH
P
1
leadframe
non-leadframe
1. Features
2. Applications
3. Dimensions
B
C
E
D
100
1536
A`
A
A
B
C
E
D
R22
1536
A`
4. Part Numbering
TMHC1205SP-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMHC
1205
SP
-
100
MN
-
D
A
B
C
D
E
F
A: Series
B: Dimension BxC.
C: Type Standard.
D: Inductance 100=10uH.
E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
F: Code Marking: Black.100and 2019H (20:YY, 19:WW, follow production date, H:P/N).
SMD Power Inductor
Recommend PC Board Pattern
L
G
H
L(mm)
G(mm)
H(mm)
14.5
8.0
5.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Series
A
A`
B
C
D
E
TMHC1205
13.5±0.5
12.6±0.3
12.6±0.2
4.7±0.3
2.3±0.3
See spec
table
Unit:mm
Halogen-free
Halogen
100
2019H
R47
2019H
TAI-TECH
P
2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
I rms( A )
Saturation
Current DC
I sat ( A )
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
E(mm)
±0.3
Type
TMHC1205SP-R22MN-D
0.22
48
95
0.50
0.55
4.7
non-leadframe
TMHC1205SP-R36MN-D
0.36
41
80
0.75
0.83
4.7
non-leadframe
TMHC1205SP-R47MN-D
0.47
38
65
0.96
1.15
4.0
non-leadframe
TMHC1205SP-R68MN-D
0.68
32
54
1.40
1.60
4.0
non-leadframe
TMHC1205SP-1R0MN-D
1.00
30
50
2.00
2.40
4.7
leadframe
TMHC1205SP-1R5MN-D
1.50
27
48
3.00
3.50
4.7
leadframe
TMHC1205SP-2R2MN-D
2.20
25
40
4.30
5.00
4.7
leadframe
TMHC1205SP-3R3MN-D
3.30
20
32
7.30
8.40
4.7
leadframe
TMHC1205SP-4R7MN-D
4.70
14
27
11.4
15.0
4.7
leadframe
TMHC1205SP-6R8MN-D
6.80
12
23
14.5
16.7
4.7
leadframe
TMHC1205SP-8R2MN-D
8.20
11.5
20
18.6
21.5
4.7
leadframe
TMHC1205SP-100MN-D
10.0
11
17
21.4
25.5
4.7
leadframe
TMHC1205SP-150MN-D
15.0
9.0
13
32.6
38.0
4.7
leadframe
TMHC1205SP-220MN-D
22.0
7.5
11
50.0
58.0
4.7
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
Δ
T of 40
℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.