TAI-TECH
P1
leadframe
non-leadframe
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
100
2019
A`
A
B
C
E
D
R47
2019
A`
4. Part Numbering
TMPA1265SP-Series(N)-D
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
SP
-
100
MN
- D
C
D
E
F
A: Series
B: Dimension BxC.
C: Type Standard.
D: Inductance 100=10uH.
E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
F: Code Marking: Black.100 and 2019(20 YY, 19 WW,follow production date).
SMD Power Inductor
Recommend PC Board Pattern
L
G
H
L(mm)
G(mm)
H(mm)
14.5
8.0
5.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
Series
A
A`
B
C
D
E
TMPA1265
13.5±0.5
12.6±0.3
12.6±0.2
6.2±0.3
2.3±0.3
See Spec
table
Unit:mm
Halogen-free
Halogen
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
Irms ( A )
Saturation
Current DC
I sat ( A )
DCR
(mΩ)
Typ
DCR
(mΩ)
Max
E(mm)
±0.3
Type
TMPA1265SP-R47MN-D
0.47
42
68
0.88
1.02
4.7
non-leadframe
TMPA1265SP-R68MN-D
0.68
36.5
55
1.25
1.5
4.0
non-leadframe
TMPA1265SP-1R0MN-D
1.00
33
45
1.5
1.8
4.0
non-leadframe
TMPA1265SP-1R5MN-D
1.50
29
35
2.2
2.53
4.0
non-leadframe
TMPA1265SP-2R2MN-D
2.20
25
28.5
3.7
4.2
4.7
leadframe
TMPA1265SP-3R3MN-D
3.30
22
27
5.3
6.2
4.7
leadframe
TMPA1265SP-4R7MN-D
4.70
20
25
6.8
8.0
4.7
leadframe
TMPA1265SP-5R6MN-D
5.60
18
23
8.3
9.8
4.7
leadframe
TMPA1265SP-6R8MN-D
6.80
16.5
21
9.8
11.3
4.7
leadframe
TMPA1265SP-8R2MN-D
8.20
15
19
12
13.8
4.7
leadframe
TMPA1265SP-100MN-D
10.0
13
17
13
15.8
4.7
leadframe
TMPA1265SP-150MN-D
15.0
11
13.5
22
26
4.7
leadframe
TMPA1265SP-220MN-D
22.0
10
10
31
35
4.7
leadframe
TMPA1265SP-330MN-D
33.0
9.0
9.0
46
55
4.7
leadframe
TMPA1265SP-470MN-D
47.0
8.0
7.6
58
67
4.7
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25
℃
ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.