RF lter companion chips for STM32WB55 wireless MCUs with integrated

harmonics lter and impedance matching network

Harmonics lter and impedance

matching for STM32WB wireless MCUs

MLPF-WB55

RF FILTERS

KEY FEATURES & BENEFITS

• Optimum impedance matched

for STM32-WB55 wireless

microcontollers

• Simplies impedence matching and

ltering

• Low temperature variation and 85%

less PCB space compared with

discretes

• Cost effectiveness thanks to reduced

RF BOM

KEY APPLICATIONS

• Diagnostics, e-metering, and

industrial applications

• Smart home devices, RF tags and

nders, toys and gaming

• Wearables, medical equipment, asset

tracking, e-payment, and smart cards

•

Standards supported: Bluetooth 5,

OpenThread, Zigbee and

IEEE 802.15.4

www.st.com

Based on ST’s IPD technology on

non-conductive glass substrate,

our MLPF-WB55 series of

RF lters with an integrated

harmonics lter and impedance

matching network are specically

designed as a companion

chip for STM32WB wireless

microcontrollers.

Thanks to a 50 Ω nominal

impedance on the antenna side,

a deep rejection harmonics

lter and low insertion losses,

these high-quality RF passive

components on a single glass

substrate optimize the MCUs’

RF performance while offering a

small footprint and low thickness.

For more information on ST products and solutions, visit www.st.comOrder code: FLMLPFWB0820

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All other product or service names are the property of their respective owners.

Matching network and

harmonics lter

Combining a matching network

and harmonics lter in a low prole

package customized for STM32WB55

wireless microcontrollers, our MLPF-

WB55 RF lters are single-component

solutions that offers low dispersion over

temperature and a small footprint.

Design issues

For 2.4 GHz wireless applications, the

path between the antenna and the

pins of the RF transceiver must feature

a matched impedance optimized to

guarantee the best Receive sensitivity

and Transmit output power levels.

Moreover, this RF path must also limit

harmonic emissions in compliance with

regulatory agencies including FCC,

ETSI and ARIB.

Other issues when using discrete

components is that the resulting

network is very sensitive to temperature

variations. The rework is often needed

if one component reference is changed

for another passive supplier and the

discrete network occupies a large PCB

space.

ST’s solution

ST’s IPD technology integrates high-

quality RF passive components on a

single glass substrate. This ensures an

ultra-small footprint providing optimum

impedance to guarantee the best RF

performance even under temperature

variations, removing the hassle for

the RF designer to manage all these

constraints. With the MLPF-WB55

series, ST is the only semiconductor

supplier offering an integrated RF

lter and impedance matching with

fully optimized performance for our

STM32WB55 RF microcontrollers.

A single device to replace a discrete matching network plus harmonic lter

Available Devices

Pin count

256 K / 128 K

1 M / 256 K

48-pins

7x7mm

UQFN (p=0.5)

68-pins

8x8mm

VQFN (p=0.4)

100-pins

4.39x4.37mm

WLCSP(p=0.4)

STM32WB55CC STM32WB55RC STM32WB55VC

STM32WB55CE

STM32WB55RE STM32WB55VE

STM32WB55CG

STM32WB55RG STM32WB55VG

Flash memory / RAM size (bytes)

512 K / 256 K

MLPF-WB55-01E3 MLPF-WB55-02E3

Part Number MOQ Package Packing Companion Chip for...

MLPF-WB55-01E3 5000 CSP Bumpless Tape and Reel (7")

STM32-WB55-CG, STM32-WB55-CE, STM32-WB55-CC

STM32-WB55-RG, STM32-WB55-RE, STM32-WB55-RC

MLPF-WB55-02E3 5000 CSP Bumpless Tape and Reel (7") STM32-WB55-VG, STM-32WB55-VE, STM32-WB55-VC

MLPF-WB55 RF FILTERS Matched lter companion chips for STM32WB55 wireless microcontrollers