NVT4858
SD, SDIO, mini SD, micro SD and SIM card voltage level
translator with EMI filter and ESD protection
Rev. 2.0 — 15 September 2021 Product data sheet
1 General description
The device is an SD 3.0-compliant bidirectional dual voltage level translator with auto-
direction control. It is designed to interface between a memory or SIM card operating
between 1.65 V to 3.6 V signal levels and a host with a supply voltage of 1.08 V to
1.95 V.
The device supports SD 3.0 SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-
Speed (50 MHz) and Default-Speed (25 MHz) modes. The device has an auto-enable/
disable function connected to the V
CCB
supply pin, built-in EMI filters and robust ESD
protections (IEC 61000-4-2, level 4) on V
CCB
or any of the card side pins. External ESD
diodes are not required.
This device also supports SIM card voltage level translator using CLK and two of the data
lines for SD and SIM card combo sockets.
2 Features and benefits
• Supports up to 208 MHz clock rate
• SD 3.0 specification-compliant voltage translation to support SDR104, SDR50, DDR50,
SDR25, SDR12, High-Speed and Default-Speed modes
• Compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart Card interface
requirements
• Support SD/SIM card supply voltages with range of 1.65 V to 3.6 V
• Host microcontroller operating voltage range: 1.08 V to 1.95 V
• Feedback channel for clock synchronization
• Low power consumption by push-pull output stage with break-before-make architecture
• Automatic enable and disable through V
CCB
• Integrated pull-up and pull-down resistors: no external resistors required
• Integrated EMI filters suppress higher harmonics of digital I/Os
• Integrated 8 kV ESD protection according to IEC 61000-4-2, level 4 on on V
CCB
or any
of the card side pins. External ESD diodes are not required.
• Level shifting buffers keep ESD stress away from the host (zero-clamping concept)
• Available in XQFN16 with 0.4 mm pitch and WLCSP16 with 0.35 mm pitch
3 Applications
• Smart phones
• Mobile handsets
• Digital cameras
• Tablet PCs
• Laptop computers
• SD, MMC or microSD card readers
NXP Semiconductors
NVT4858
SD, SDIO, mini SD, micro SD and SIM card voltage level translator with EMI filter and ESD protection
4 Ordering information
PackageType number Topside mark
Name Description Version
NVT4858UK N858 WLCSP16 wafer level chip scale package; 16 bumps (4 x 4), body
1.41 x 1.41 x 0.525 mm, 0.35 mm pitch
SOT2127-1
NVT4858HK N58 XQFN16 plastic, extremely thin quad flat package; no leads; 16
terminals; 2.6 mm x 1.8 mm x 0.50 mm body with 0.4 mm
pitch
SOT1161-2
Table 1. Ordering information
4.1 Ordering options
Type number Orderable part
number
Package Packing method Minimum
order
quantity
Temperature
NVT4858UK NVT4858UKZ WLCSP16 REEL 7" Q1/T1
[1]
3000 T
amb
= -40 °C to +85 °C
NVT4858HK NVT4858HKZ XQFN16 REEL 7" Q1/T1 SSB
[2]
[3]
4000 T
amb
= -40 °C to +85 °C
Table 2. Ordering options
[1] Find packing information at www.nxp.com/docs/en/packing/SOT2127-1_012.pdf
[2] This packing method uses a Static Shielding Bag (SSB) solution. Material is to be kept in the sealed bag between uses.
[3] Find packing information at www.nxp.com/docs/en/packing/SOT1161-2_471.pdf
NVT4858 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved.
Product data sheet Rev. 2.0 — 15 September 2021
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