LTE Antenna -3 - 4 dBi PCB internal solder mounting
Description
This LTE antenna can be soldered onto a circuit board to
receive and transmit signals.
Specification
• Connector: SMT solder pads
• Frequency range:
700 - 960 MHz
1710 - 2690 MHz
• GSM, UMTS, LTE, ZigBee, DECT, Z-Wave, NB-IoT, WLAN, Bluetooth, LoRa
• Antenna gain: -3.0 - 4.1 dBi
• Impedance: 50 Ohm
• Operating temperature: -40 °C ~ 85 °C
• Dimensions (LxWxH): ca. 28.0 x 3.0 x 0.8 mm
System requirements
• PCB with free SMT solder pads
Package content
• Antenna
Item no. 12709
EAN: 4043619127092
Country of origin: China
Package: Zip poly bag
Images
© 2021 by Delock. All names and symbols mentioned here are property of the respective producer. Printing errors,
changes and errors excepted.
www.delock.de
12709
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22.07.2021
Technical characteristics
Antenna gain: - 3.0 - 4.1 dBi
Impedance: 50 Ω
VSWR: 3.7 (700 - 960 MHz); 2.1 (1710 - 2690 MHz)
Physical characteristics
Length: 28.0 mm
Width: 3.0 mm
Height: 0.8 mm
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© 2021 by Delock. All names and symbols mentioned here are property of the respective producer. Printing errors,
changes and errors excepted.
www.delock.de
12709
2 / 2
22.07.2021