306.751
No Part Name Material Name
Material
Supplier
Material Content
(Element)
CAS Number
Material Mass
(mg)
Material Mass
(%)
Substance wt
(%)
Substance wt
(mg)
1
Chip Silicon PSMC Silica 7440-21-3
45.399 14.800% 100.00% 45.399
Thermosetting resin with fiber glass Trade secret
22.60% 7.730
Copper 7440-50-8
41.01%
14.026
Au 7440-57-5
0.91%
0.311
Nickel 7440-02-0
8.18%
2.798
Acrylic resin
Trade secret
12.09%
4.135
Epoxy resin
Trade secret
6.05%
2.068
Talc containing no asbestos
14807-96-6
2.57%
0.878
Barium Sulfate
7727-43-7
4.03%
1.379
Silica, amorphous
7631-86-9
2.57%
0.878
Synthetic rubber (Die attach film)
Trade secret
5.00%
0.632
Silica, amorphous(Die attach film)
7631-86-9 35-45
35.00%
4.423
Phenol resin (Die attach film)
Trade secret
20.00%
2.528
Epoxy resin (Die attach film)
Trade secret
20.00%
2.528
Polypropylene copolymer (Dicing tape)
Trade secret
20.00%
2.528
Au 7440-57-5 99.00%
1.063
Pd 7440-05-3 1.00%
0.011
Epoxy Resin Trade secret 6.00%
11.135
Phenol Resin Trade secret 6.00%
11.135
Carbon Black 1333-86-4 0.30%
0.557
Silica 60676-86-0 87.70%
162.757
Sn 7440-31-5 96.50% 26.878
Ag 7440-22-4 3.00% 0.836
Cu 7440-50-8 0.50% 0.139
306.751
AS4C256M32MD4V-062BAN
(8Gb - LPDDR4X)
ALLIANCE MEMORY MATERIAL DECLARATION
Alliance Memory Inc. 12815 NE 124th Street Suite D Kirkland, WA 98034 Tel: 425-898-4456
Pg 1 of 1
Die attach film Epoxy
Bonding wire
PART WEIGHT (mg)
11.150%
Metal
Solder ball
Nitto
Tanaka
Resin
Metal
Resin
Senju
27.853
3
Molding Compound
Hitachi
Approved by:
Quality@AllianceMemory
Substrate
34.2032
Simmetch
PART NUMBER
0.350%
60.500%
9.080%
4.120%
4
5
6
12.638
1.074
185.584