General Features
● V
DS
=60V,I
D
=3A
R
DS(ON)
<105mΩ @ V
GS
=10V
R
DS(ON)
< 125mΩ @ V
GS
=4.5V
● High power and current handing capability
● Lead free product is acquired
● Surface mount package
Application
●Battery switch
●DC/DC converter
D
G
S
Schematic Diagram
Pin Assignment
Absolute Maximum Ratings (T
A
=25℃unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
60 V
Gate-Source Voltage
V
GS
±20 V
Drain Current-Continuous
I
D
3 A
Drain Current-Pulsed
(Note 1)
I
DM
10 A
Maximum Power Dissipation
P
D
1.7 W
Operating Junction and Storage Temperature Range
T
J
,T
STG
-55 To 150 ℃
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient
(Note 2)
R
θJA
73.5
/W℃
Electrical Characteristics (T
A
=25℃unless otherwise noted)
Parameter Symbol Condition Min Typ Max Unit
Off Characteristics
Drain-Source Breakdown Voltage BV
DSS
V
GS
=0V I
D
=250μA 60 65 - V
Zero Gate Voltage Drain Current I
DSS
V
DS
=60V,V
GS
=0V - - 1 μA
N-Channel
Power MOSFET
SL2310
1
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SOT-23 top view
Gate-Body Leakage Current I
GSS
V
GS
=±20V,V
DS
=0V - - ±100 nA
On Characteristics
(Note 3)
Gate Threshold Voltage V
GS(th)
V
DS
=V
GS
,I
D
=250μA 1.0 1.3 2.0 V
V
GS
=10V, I
D
=3A - 78 105 mΩ
Drain-Source On-State Resistance R
DS(ON)
V
GS
=4.5V, I
D
=3A - 95 125 mΩ
Forward Transconductance g
FS
V
DS
=15V,I
D
=2A 3 - S
Dynamic Characteristics
(Note4)
Input Capacitance C
lss
- 247 - PF
Output Capacitance C
oss
- 34 - PF
Reverse Transfer Capacitance C
rss
V
DS
=30V,V
GS
=0V,
F=1.0MHz
- 19.5 - PF
Switching Characteristics
(Note 4)
Turn-on Delay Time t
d(on)
- 6 - nS
Turn-on Rise Time t
r
- 15 - nS
Turn-Off Delay Time t
d(off)
- 15 - nS
Turn-Off Fall Time t
f
V
DD
=30V,I
D
=1.5A
V
GS
=10V,R
GEN
=1Ω
- 10 - nS
Total Gate Charge Q
g
- 6 - nC
Gate-Source Charge Q
gs
- 1 - nC
Gate-Drain Charge Q
gd
V
DS
=30V,I
D
=3A,
V
GS
=4.5V
- 1.3 - nC
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
V
SD
V
GS
=0V,I
S
=3A - - 1.2 V
Diode Forward Current
(Note 2)
I
S
- - 3 A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
SL2310
2
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