Page 1
Formosa MS
FFM101-MH THRU FFM107-MH
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121203 2008/02/10 2010/11/10 D 7
Chip Fast Recovery Rectifiers
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2
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5
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings ...................................
and Electrical characteristics
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H
Terminals :Plated terminals, solderable per MIL-STD-750,
•
Method 2026
Polarity : Indicated by cathode band
•
Mounting Position : Any•
Weight : Approximated 0.011 gram•
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Formosa MS
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers•
better reverse leakage current and thermal resistance
Low profile surface mounted application in order to
•
optimize board space
iny plastic SMD package
• T
High current capability
•
•
Fast switching for high efficiency
High surge current capability
•
Glass passivated chip junction•
Lead-free parts meet RoHS requirements•
•
Suffix "-H" indicates Halogen-free parts, ex. FFM101-MH-H
PARAMETER
CONDITIONS
Forward rectified current
Forward surge current
Reverse current
Diode junction capacitance
Storage temperature
See Fig.2
8.3ms single half sine-wave (JEDEC methode)
f=1MHz and applied 4V DC reverse voltage
Symbol
MIN.
TYP.
MAX.
UNIT
I
O
I
FSM
I
R
C
J
T
STG
A
A
μA
O
C
pF
1.0
25
5.0
+175
-65
V = V T = 25 C
R RRM J
O
V = V T = 125 C
RRRMJ
O
15
100
FFM101-MH
FFM102-MH
FFM103-MH
50
100
200
35
70
140
SYMBOLS
V
RRM
(V)
V
RMS
V
R
(V)
(V)
*1
*2
*3
V
F
(V)
*4
FFM104-MH
FFM105-MH
400
600
280
420
1.30
-55 to +150
FFM106-MH
FFM107-MH
800
1000
560
700
t
rr
(ns)
*5
150
250
500
50
100
200
400
600
800
1000
FFM101-MH THRU FFM107-MH
(C)
O
Operating
temperature
T,
J
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I =1.0A
F
*5 Maximum Reverse recovery time, note 1
Note 1. Reverse recovery time test condition, I =0.5A, I =1.0A, I =0.25AFRRR
DS-121203 2008/02/10 2010/11/10 D 7
Maximum ratings and Electrical characteristics (AT T =25 C unless otherwise noted)
A
o
Chip Fast Recovery Rectifiers
Package outline
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
0.040(1.0)
0.024(0.6)
0.031(0.8) Typ.0.031(0.8) Typ.
Dimensions in inches and (millimeters)
SOD-123H
Thermal resistance
R
θJA
O
C/W
73
Junction to ambient
Junction to case
53
R
θJC