ASC300N1200MD3
1
1200V SiC MOSFET Module
AlSiC Baseplate and Aluminum Oxide Insulator
System Benefits
Enables Compact, Lightweight, Efficient Systems
Harsh Outdoor Environment Installation
Mitigates Over-voltage Protection
Reduced Thermal Requirements
Reduced System Cost
Package 151mm x 103mm x 35.2mm
Part Number
Package
Marking
ASC600N1200MD3
DWC3
ASC300N1200MD3
Absolute Maximum Ratings (TC = 25℃ unless otherwise specified)
Symbol
Parameter
Value
Unit
V
DS
Drain-Source Voltage
1200
V
V
GS
Gate-Source Voltage
-4/+20
V
I
D
Drain Current(continuous) V GS =20V
300
A
I
DM
Drain Current (10us pulsed)
600
A
P
D
Power Dissipation T
C
= 25°C
960
W
T
C,
Tstg
Operating and Storage Temperature Range
-40 to +150
T
J
Junction Temperature
175
LStray
Stray Inductance
20
nH
Features
High Temperature, Humidity, and Bias Operation
Ultra Low Loss
High-Frequency Operation
Zero Turn-off Tail Current from MOSFET
Normally-off, Fail-safe Device Operation
Ease of Paralleling
ASC300N1200MD3
2
Electrical Characteristic
s (TC = 25℃ unless otherwise specified)
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Drain-source BreakdownVoltage
I
D
=1.2mA,V
GS
=0V
1200
V
Zero Gate Voltage Drain Current
V
DS
=1200V, V
GS
=0V
5
500
uA
Gate-body Leakage Current
V
GS
=20V,V
DS
=0V
1.3
uA
Gate Threshold Voltage
V
DS
= V
GS,
I
D
=50mA
2
4
V
Static Drain-source On Resistance
V
GS
=20V, I
D
=200A
7
10
Gate Resistance
V
GS
=0V,f=1MHz
5
Input Capacitance
VDS=800V f=200kHZ,
VAC=25mV
19
nF
Output Capacitance
1.5
Reverse Transfer Capacitance
0.26
Turn-On Switching Energy
VDD=600V,VGS=-4/+20V
ID=180A,RG(ext=5)
Load=77uH,TJ=150
7.6
mJ
Turn-Off Switching Energy
9.1
mJ
Gate-Source Charge
VDD=800V, VGS=-4/+20V
ID=200A,
95
nC
Gate-Drain Charge
180
Total Gate Charge
610
Turn-on delay time
VDD=600V,VGS=-4/+20V
ID=180A,RG(ext=5)
Load=77uH,TJ=150
22
nS
Rise Time
56
Turn-off delay time
32
Fall Time
35
Diode Forward voltage
If=150A, VGS=0
6
V
Thermal Characteristics
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Thermal Resistance, Junction-to-Case
Tc=90PD=150W
0.13
C/W