TSX Series
Smiths Interconnect is a leading provider of
chip attenuators offering the widest selection of
products from DC to Q-band, backed by proven
performance and significant heritage. Chip
components are offered on Alumina, Aluminum
Nitride, Beryllium Oxide, and CVD Diamond for
a wide range of applications.
The TSX Series of chip attenuators pushes the boundaries of Size,
Weight and Power in a cost effective, easy to implement surface
mount solution, suitable for a wide array of applications.
The TSX Series offers excellent broadband RF performance to 50
GHz while delivering increased power handling in a small surface
mount format factor.
The chip attenuator design offers 1 to 3 watts of power handling
performance and multiple attenuation values are available for
surface mounting. The use of a robust, proven all thin film process
technology on an alumina substrate provides a product suitable
for harsh environments, such as those of Space and Defense
applications.
TSX Chip
Attenuators offers
excellent performance
and power from
DC-50 GHz in a small
0604 package size.
Features and Benefits
■ Small form factor - Reduces overall footprint
■ Surface mountable – Ideal for pick and place
applications
■ Broad frequency range – Reduces BOM count
■ Low VSWR – Increases transmitted power
■ Wide range of attenuation values – 1-10, 15 and 20dB
■ Tight attenuation tolerance – For optimal performance
Applications
■ Amplifier Circuits
■ Transmit/Receive Modules
■ Up/Down Converters
■ Instrumentation
■ Satellite Communications
■ Radar
■ 5G
TSX Series
Fixed Chip Attenuators
TSX Series
2
Technical Characteristics
Mounting Configuration
Options
Planar
Electrical
Nominal Impedance 50 ohms
Frequency Range DC -50 GHz
Attenuation Values
0-10, 15 & 20 dB in 1 dB Increments
Attenuation Accuracy
ATTENUATION ACCURACY (dB)
Attenuation
Value (dB)
DC–40 GHz 40–50 GHz
0
Continuity Only
1-10
± 0.50 ± 0.5
15 & 20 ± 0.50 ± 3.0
Input Power CW
INPUT POWER (CW)
dB Watts dB Watts dB Watts
0-1 3.0 2-3 2.0 4-20 1.0
Peak Power
10X CW power based on 1 µS pulse width @ 1% Duty Cycle
Environmental
Operating Temperature -55°C to +150°C
Storage Temperature -65°C to +150°C
Temperature Coefficient ±200 PPM/°C Max
Moisture Sensitivity Level MSL 1 - Unlimited
Mechanical
Substrate Material Alumina (Al
2
O
3
) 96%
Resistive Film
Thin Film, Tantalum Nitride
Terminal Material Thin Film, Solderable Gold over Nickel
Protective Coating
Silicon Nitride
Marking
Unit Marking Orientation dot and dB Value
Quality Assurance
Sample visual and mechanical inspection - 1.0 AQL per mechanical drawing requirements.
Periodic electrical inspection performed for commerical grade products.
High reliability tested products are available per MIL-PRF-55342.
Packaging
Standard Packaging Tape and Reel or Waffle Pack
VSWR
dB DC–40 GHz 40–50 GHz
0
Continuity Only
1-10
1.20:1 Max 1.25:1 Max
15-20 1.20:1 Max 1.25:1 Max
VSWR