1
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0017765
1
MMP706x Series
Rev. V2
High Power Switching and Attenuation Silicon PIN Diodes
CS11
Dimension Min. Nom. Max.
A 0.012 0.013 0.014
B 0.012 0.013 0.014
C 0.004 0.005 0.006
D 0.003 0.004 0.005
Dimensions (inches)
Consult Factory for other package styles.
Features
• Fast Switching
• Low Series Resistance
• Low Junction Capacitance
• Low Thermal Resistance
• RoHS* Compliant
Applications
• ISM
Description
The MMP7060 - 69 Series of PIN diodes are fast
switching, low series resistance, low capacitance
PIN diode chips. These diodes are also available
packaged in several other package styles. The low
junction capacitance, thin I-layer and low series
resistances combine to produce outstanding
insertion loss, isolation and switching time. The low
thermal resistance enables these devices to safely
handle moderately high power signals in high
frequency switching applications. These rugged
devices are capable of reliable operation in all
military, commercial and industrial applications.
This series of PIN diodes are designed to be used in
moderate peak and average power switch
applications which operate at high frequencies and
require low switching time. These diodes performs
exceptionally well from UHF through microwave
frequencies.
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
A
B
C
Anode
Silicon
Cathode
D
2
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0017765
2
MMP706x Series
Rev. V2
High Power Switching and Attenuation Silicon PIN Diodes
Environmental Capabilities
The MMP706x-11 Series of PIN diodes are capable
of meeting the environmental requirements of
MIL-STD-750 and MIL-STD-883.
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these (HBM) Class 0
devices.
Model
Reverse
Voltage
Breakdown
1
(V
BR
)
Junction
Capacitance
2
(C
J
)
Minority
Carrier
Lifetime
3
(T
L
)
Theta
(θ
JC
)
Series
Resistance
4
@ 1 mA
(R
S
)
Series
Resistance
@ 10 mA
(R
S
)
Series
Resistance
@ 100 mA
(R
S
)
V pF ns °C/W Ω Ω Ω
Min. Max. Typ. Max. Max. Max. Max.
MMP7060-11
250
0.05 1.0 20 25.0 10.0 2.0
MMP7061-11 0.08 1.0 20 20.0 8.0 1.5
MMP7062-11 0.10 1.0 20 15.0 6.0 1.2
MMP7063-11 0.20 1.0 15 8.0 3.5 1.0
MMP7064-11 0.30 1.5 15 6.0 2.0 0.8
MMP7065-11 0.08 1.5 15 40.0 8.0 1.5
500
MMP7067-11 0.20 1.5 12 10.0 4.0 1.0
MMP7068-11 0.30 2.0 10 8.0 3.5 0.8
MMP7069-11 0.50 2.0 10 6.0 2.0 0.7
1. Reverse Breakdown Voltage measured at 10 µA.
2. Junction Capacitance measured at 50 V, 1 MHz.
3. Minority Carrier lifetime measured with I
F
= 10 mA, I
R
= 10 mA.
4. Series Resistance is measured at 1 MHz using transmission loss techniques.
Electrical Specifications: T
A
= +25°C
Absolute Maximum Ratings
Operating Temperature -55°C to +150°C
Storage Temperature -65°C to +200°C
Assembly Temperature <300°C for 5 seconds
Assembly Instructions
Die attach of MMP706x silicon PIN diode chips may
be accomplished with conductive epoxy or a eutectic
solder such as Au(80%)/Sn(20%) or Au(88%)/
Ge(12%). Electrical connection to the cathode may
be made with a Au wire or ribbon, utilizing thermo
compression or thermosonic bonding. Care should
be exercised to not employ excessive pressure or
ultrasonic energy while wire/ribbon bonding to avoid
physical damage to the die.