CERAMIC CAPACITORS
152
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Taping : dimensions
Page revised 02/21
FEATURES
• Low ESR, Ultra High-Q, High Self-Resonant Frequencies
• RF & Microwave capacitors
• Voltage range: 50V - 1,500V
• Capacitance range: 0.1pF - 1,000pF
• Operating temperature up to 125°C*
• Porcelain Capacitors P100
• Laser Marked (optional)
• RoHS compliant
APPLICATIONS
• Cellular Base Station Amplifi ers
• Industrial
• Medical (MRI)
• Scientifi c
CIRCUIT APPLICATIONS
• DC to RF Conversion
• Matching Networks
• Tuning, Coupling and DC Blocking
PHYSICAL CHARACTERISTICS
• Chip capacitors for surface mounting with copper
(non magnetic) or nickel barrier and tinning
• Ribbon leads for surface mounting
ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS
Electrical specifi cations
Parameter Value
Capacitance 0.1pF - 1,000pF
Tolerances
A, B, C, D below 10pF
F, G, J, K above 10pF
Working voltage (WV
DC
) See capacitance range chart
Temperature coeffi cient (100 ± 30) ppm/°C, –55°C to +125°C
Insulation Resistance 10
6
MΩ min.
Dielectric Withstanding
(test voltage applied for 5 seconds)
2.5 x WV
DC
for WV
DC
≤ 500V
1.8 x WV
DC
for extended range values ≥ 820pF
1.5 x WV
DC
for WV
DC
> 500V
Aging none
Piezo Effect none
Environmental specifi cations
Parameter Value
Life Test
2,000 hours, +125°C at 2 x WV
DC
(standard WV
DC
range)
And CHB up to 100pF: 1,000 hours, 175°C at 500V
Moisture Resistance Test 1
240 hours, 85% relative humidity at 85°C
(ESA/SCC n°3009)
Moisture Resistance Test 2
56 days, 93% relative humidity at 40°C
0V, 5V, WV
DC
* The temperature range for the CHB up to 100pF is upgrated from +125°C to +175°C.
HOW TO ORDER
152 CH B 100 J S 1 L E -RoHS
Voltage code Dielectric Size code Capacitance code Tolerance code Termination code Ribbon code Marking code Tape and reel
500 = 50V
101 = 100V
201 = 200V
251 = 250V
301 = 300V
501 = 500V
601 = 600V
102 = 1,000V
152 = 1,500V
Please refer to voltage given
in capacitance range chart
CH =
(100±30)
ppm/°C
A = 0505
B = 1111
Please refer to
capacitance code
given in capacitance
range chart
A = ±0.05pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
See note 1
S = Standard:
tin-plated nickel
C = Non-magnetic:
tin-plated copper
See note 2
-: no lead or ribbon
Available on size
1111:
1 = Micro-strip
ribbons
6 = Radial leads
0.1pF (0R1) non
available with
these terminations.
See note 3
-: no marking
L = laser marking
-: no tape and reel
E = horizontal orientation
X = verticale orientation
CHA:
3,000 components per reel
CHB:
1,000 components per reel
The RoHS tag is
not part of the
reference
Tag added at the
end of P/N for
information
Note 1: For capacitance values less than 10pF, tolerances B, C and D available. Tolerance code A available for: A case for capacitance values of 0.1pF - 4.7pF. B case for capacitance values of 0.1pF - 3.3pF. For capacitance values of 10pF or higher,
tolerances F, G, J and K available.
Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated.
Note 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certifi ed types to ensure that only non-magnetic materials are used.
Note 4: Ribbon lead styles capacitors are not available in Tape and Reel.
Examples: 501 CHB 470 J1L any termination material could be used. 501 CHB 470 JC1L only non-magnetic termination materials could be used.
Please consult us for specifi c requirements.
ESA Qualified
According to
CH Series Classic HiQ
CERAMIC CAPACITORS
126
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Taping : dimensions
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CAPACITOR TERMINATIONS AND SOLDERING
RECOMMENDATIONS
I. TERMINATION TYPES
Our capacitors are delivered with one of the following terminations (for
technical reasons, only a limited number of termination types are available in
certain cases). All our terminations are backward compatible.
NB:
• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical
reason, we have also another code, the code “P”, for the same type of
termination. The parts that were designed-in before 2005 might still have
a code “P” instead of “A” in the part numbering. But both codes correspond
to the same type of termination).
II. SPECIFICATIONS
Care must be taken when using particular terminations: if the terminations are
heated up above a particular temperature and/or for too long a period of time,
there is a risk of leaching (dissolution of the termination revealing the inner
electrodes).
The chart below gives the resistance to soldering heat per termination type,
based on a SAC387 solder bath at 260°C.
Dielectric Type A C S
CHA / SHA 10
±1s
(3) 120
±5s
CHB / SHB 30
±2s
120
±5s
CPX / CLX / CPE / CLE 30
±2s
120
±5s
CLF 10
±2s
(1) On request 120
±5s
SHL 120
±5s
SHS 10
±1s
(4) 120
±5s
SHF / SHN / SHT 5
±1s
(2) 120
±5s
(1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath.
(2): data obtained with Sn62/Pb36/Ag2 solder bath.
(3): termination only available on CHA series.
(4): preliminary data.
III. STANDARD SMD REQUIREMENTS
III.1. Soldering Recommendations
Regarding the soldering attachments, three methods are generally used: the
vapor phase soldering, the infrared reflow soldering and the wave soldering.
Unless particular skill about the use of the wave soldering, this method is not
recommended since the melted solder is directly in contact with the ceramic.
This can potentially crack the capacitor because the ceramic is sensible to the
thermal shocks. Moreover, this method needs to maintain the components
with an insulating resin which increases the thermo-mechanical strains
between the ceramic and the board both on soldering phase and operating
condition. The vapor phase and IR reflow soldering are less aggressive,
inducing more restricted thermal shocks. This is the reason why they are
preferred to the wave soldering method for reliable applications. In all cases,
proper pre-heating is essential.
The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of
the maximum soldering temperature. While multilayer ceramic capacitors can
withstand the peak soldering temperatures for short durations, they should be
minimized whenever possible.
Above precaution given for SMD types are applicable for the implementation
of large bare chips (1515 and above). But in general, large bare chips above
2225 are not recommended to be mounted on epoxy printed board due to the
thermal expansion mismatch between ceramic capacitor body and epoxy. This
is the reason why leaded components will be preferred especially for reliable
applications.
For information, the typical thermal profiles of these three soldering processes
are given hereafter. These typical diagrams are only given as an aid to SMD
users in determining specific processes linked to their instrumentations and
to their own experience.
NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards.
Please, refer to this standard for more information.
III.1.1. Vapour Phase Soldering
0°C
0s 20s 40s 60s 80s 100s 120 s 140s 160s 180s 200s 220s 240s
250°C
230°C
20s ... 40s
ca. 60s ... 130s
>217°C
217°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
200°C
150°C
100°C
50°C
Lead free SnAgCu solders - Vapour Phase
0°C
0s 20s 40s 60s 80s 100s 120 s 140s 160s 180s 200s 220s 240s
250°C
210°C
20s ... 40s
ca. 60s ... 150s
<180°C
180°C
Ramp down
rate <6K/s
Ramp up
rate <3K/s
200°C
150°C
100°C
50°C
SnPb solders – Infrared Soldering
NB: the lines indicate the upper and lower limits of typical process (terminal
temperature).
Parameter Value Comment
Termination
Materials
A
C
S
non-magnetic (silver-palladium)
non-magnetic (pure tin over copper barrier)
lead-free (pure tin over nickel barrier)
General Information