Diodes Inc. Material Data Sheet

Rev: June 2008

Part Number: p = package designator

Weight (mg): 5.2603

Element

Material

Group

Materials

CAS (if

applicable)

Average mass

homogeneous

Materal(%)

Percent

of whole

(%)

Mass (mg)

ppm

Homogeneous

Material

ppm overall

Chip Silicon w/Metal

Doped Silicon

7440-21-3 100.00% 1.07 0.0562

1000000 10684

Fe 7439-89-6 57.65%

576500 140380

Ni 7440-02-0 41.00%

410000 99836

Mn 7439-96-5 0.60%

6000 1461

Cr(not Cr 6+) 7440-47-3 0.10%

1000 244

Co 7440-48-4 0.50%

5000 1218

Si 7440-21-3 0.15%

1500 365

Leadframe Plating Silver Silver 7440-22-4 100.00% 0.96 0.0505

1000000 9600

Bond Wire Gold Wire Gold 7440-57-5 100.00% 0.14 0.0076

1000000 1445

Silicone dioxide 60676-86-0 69.00%

690000 486776

Ortho Creson Novolac Epoxy Resin 29690-82-2 12.25%

122500 86420

Basic Duromer:Phenolic resin (Compound of

polymeric network)

9003-35-4 5.50%

55000 38801

Misc. system 12.75%

127500 89948

Carbon black 1333-86-4 0.50%

5000 3527

Lead Plating Finish Matte Tin Tin 7440-31-5 100.00% 2.93 0.1541

100000

29295

Total 100.00 5.2603 100000

Tolerance ±10%

Asbestos Ozone Depleting Substances - Class I (CFCs, HBFCs, etc.)

Azo compounds Ozone Depleting Substances - Class II (HCFCs)

Cadmium and cadmium compounds Perfluorooctane Sulphonate (PFOS) or related compounds

Certain Shortchain Chlorinated Paraffins

Polybrominated biphenyls (PBB) and Polybrominated diphenyl ethers (PBDE) including DecaBDE

Chlorinated organic compounds Polychlorinated Biphenyls (PCBs)

Hexavalent chromium compounds Polychlorinated Naphthalenes ( > 3 chlorine atoms)

Lead and lead compounds Radioactive Substances

Mercury and mercury compounds Tributyl Tin (TBT) and Triphenyl Tin (TPT)

Organic tin compounds Tributyl Tin Oxide (TBTO)

This product or product family does not contain any of the following substances except as CURRENTLY exempted by ELV II and RoHS and reported above:

24.35

70.55

1N5711WS-(p)-F

1.2809

3.711

Alloy 42

KTMC1050G

See Data Sheet

Leadframe

Encapsulation

This data is based on information provided by our suppliers. We believe it to be correct but do not routinely validate it by measurement. It is for guidance only and Diodes Inc. does

not guarantee its absolute accuracy or completeness

* The Silicon Chip is doped at atomic levels with trace amounts of elements that may include Phosphorus, Boron, Arsenic, and other elements. Metalization may include Titanium,

Nickel, Aluminum, Silver or Gold These substances are not reported where their concentration is less than the minimum reportable level per the guidelines specified in the Tables

EIA JIG-101, Material Composition Declaration for Electronic Products.

3050 E. Hillcrest Dr.

Westlake Village, CA 91362

(805) 446-4800