Planar X Series
Planar X Series is part of an overarching initiative
by Smiths Interconnect that entails the creation
of best-in-class planar RF filter solutions designed
and tested to support various applications
markets.
Planar X Series compliments Smiths Interconnect’s
broad portfolio of RF/Microwave components
with bandpass, bandstop, lowpass and highpass
configurations up to 30 GHz (Ku-Band) offering
p
remium performance in a small package. The
frequency of operation can be further extended
with added material and process capabilities.
Planar X Series leverages Smiths Interconnect’s existing thick film
process technology on various dielectric substrates which are
designed for use in harsh high-reliability environments. The small
footprint, light weight and surface mountable configuration allow for
high volume pick and place applications and are ideal for SATCOM,
Radar and Broadcasting industries. In addition, Smiths Interconnect
offers value added high-reliability test options providing assurance
in mission critical defense and space applications.
Regardless of the application, our internal processes and procedures
help ensure that all filters are fully compliant to customers’
specifications.
Best-in-class RF Filter
solutions up to 30 GHz
designed and tested
to support various
applications and markets.
Features and Benefits
■ Small form factor – Reduced PCB Footprint
■ Light Weight – Reducing overall system mass in
critical space applications
■ Surface Mountable – Ideal solutions for Pick and
Place Applications
■ Robust Materials – Suitable for Harsh Environment
■ Frequency Offerings up to 30 GHz – Suitable for a
wide array of applications
Applications
■ Transmit/Receive Modules
■ Up/Down Converters
■ Instrumentation
■ Satellite Communications
■ Radar
■ Broadcast
Planar X Series
BOARD LEVEL CERAMIC BASED THICK FILM RF FILTER CAPABILITY
Planar X Series
2
Technical Capability Characteristics
Filter Design Capabilities
Electrical
Characteristic Impedance
50 ohms
Operating Frequency
Up to 30 GHz
Rejection Criteria
Up to 30 dB over 5% Bandwidth
Input Power CW
Up to 10 Watts
Environmental
Operating Temperature
-40°C to +85°C
Storage Temperature
-65°C to +150°C
Moisture Sensitivity Level
1 - Unlimited
Mechanical
Configuration
Surface Mount or Wire Bondable Chip Packages
Package Size
Varies based on Electrical Requirements and Dielectric
Substrate Materials
Various Dielectrics Options Available
Conductor Material
Thick Film with Tin/Lead or RoHS Compliant Silver Plating
Shielding Material
Stainless Steel (If required)
Quality Assurance
Sample visual and mechanical inspection - 1.0 AQL per mechanical drawing requirements
Periodic electrical inspection performed for commerical grade products
High reliability tested products are available
Marking
Unit Marking
Available if required
Packaging
Standard Packaging
Waffle Pack or Tape and Reel