by: NXP Semiconductors
1 Introduction
This document describes key differences and new features on i.MX RT1170,
compared with i.MX RT1060. This document can be used as the migration
reference. It is intended for audience:
• who have developed some projects based i.MX RT1060 and decided to
migrate the project into i.MX RT1170.
• who is familiar with i.MX RT1060 and want to start the new project
based on previous knowledge on i.MX RT1060.
Contents
1 Introduction......................................1
2 SOC comparison.............................2
3 Package.......................................... 4
4 Pin mux........................................... 4
5 Power supply change......................5
6 Clock............................................... 5
6.1 Overview......................................5
6.2 Oscillator & PLL........................... 6
7 Power mode/management.............. 6
8 DMA................................................ 6
9 Memory map................................... 6
10 ECC.................................................7
11 Graphic and display........................ 8
11.1 Graphics Processing Unit (GPU2D)
.....................................................8
11.2 LCDIFv2.......................................8
12 Audio............................................... 9
12.1 ASRC...........................................9
12.2 PDM MIC interface.......................9
13 Low speed peripherals.................. 10
13.1 FlexIO........................................ 10
14 EMVSIM........................................ 10
15 Watchdog...................................... 10
16 Analog........................................... 11
17 Boot...............................................11
18 Security......................................... 12
19 Software migration consideration..14
20 References....................................14
21 Revision history.............................14
AN13106
Migration guide from i.MX RT1060 to i.MX RT1170
Rev. 1 — February 18, 2021
Application Note
2 SOC comparison
Table 1 lists the SOC comparisons. Text in red is new features on i.MX RT1170.
Table 1. SOC comparison
Items for comparison i.MX RT1060 i.MX RT1170
Core and on-chip RAM
Core 0
CM7 @ Up to 600 MHz
32 KB I-Cache
32 KB D-Cache
CM7 @ Up to 1 GHz
32 KB I-Cache
32 KB D-Cache
Core 1 —
CM4 @ Up to 400 MHz
16 KB I-Cache
16 KB D-Cache
FLEX RAM 512 KB 512 KB
OCRAM
512 KB
512 KB + 128 KB OCRAM1
512 KB + 128 KB OCRAM2
256 KB (Shared with CM4 TCM)
External memory interface
SEMC - SDRAM
8/16-bit SDRAM
up to 166 MHz
8/16/32-bit SDRAM
Up to 200 MHz
SEMC - NAND 8/16-bit SLC NAND FLASH 8/16-bit SLC NAND FLASH
SEMC - Parallel NOR FLASH/SRAM Up to 16 bit Up to 16 bit
uSDHC - SD/eMMC eMMC 4.5/SD 3.0 eMMC 5.0/SD 3.0
Flex SPI 2 2
Flex SPI - Width Up to 8 bit Up to 16 bit
Flex SPI - Single/Dual/Quad SPI interface √ √
Flex SPI - Hyper √ √
Flex SPI - PSRAM — √
Flex SPI - OCT interface with XIP support √ √
Graphic, Display & Camera
LCDIF √ √
LCDIFv2
—
√
Table continues on the next page...
NXP Semiconductors
SOC comparison
Migration guide from i.MX RT1060 to i.MX RT1170, Rev. 1, February 18, 2021
Application Note 2 / 15