NXP Semiconductors
MPC574xP Hardware Design Guide
by: NXP Semiconductors
1. Introduction
The MPC574xP is a Power Architecture
®
based
microcontroller targeting automotive chassis and
safety applications. This microcontroller features a
number of analog, communication, and safety
modules, as well as two e200z4 core complexes
running in delayed lock step at up to 200 MHz
The MPC574xP requires both 3.3 V and 1.25 V
supplies. These supplies can either both be provided
externally, or the 3.3 V supply can be used to
generate the 1.25 V supply via an internal regulator
and external ballast transistor. In the simplest
configuration, a single 3.3 V supply can power the
entire device.
The intention of this application note is to provide:
• Power supply requirements and the correct
external circuitry required for each supply
• Guidelines for handling injection current,
including requirements for power supply
ramp rates
• Proper configuration of the external PLL
circuitry
• Example external interfaces for the
communication and analog modules
NXP Semiconductors
Document Number: AN5267
Application Notes
Rev. 3
,
06/2020
Contents
1. Introduction ....................................................................... 1
2. Package Options ................................................................ 2
3. Pinouts and Ball Maps ....................................................... 3
3.1. 144 LQFP Pinout .................................................... 3
3.2. 257 MAPBGA Ball Map ........................................ 5
4. Power Supplies .................................................................. 6
4.1. Voltage Monitoring ................................................ 8
4.2. Power-up Sequence ...............................................10
4.3. Decoupling Capacitors ...........................................12
5. Clock Circuitry ................................................................ 12
6. Reset ................................................................................ 13
6.1. Reset Pins ..............................................................13
6.2. Boot Configuration ................................................14
6.3. Pin Startup and Reset States ..................................15
7. Debug Connections .......................................................... 15
7.1. JTAG Interface ......................................................16
7.2. Nexus Parallel Trace Interface ............................... 16
7.3. Nexus Serial Trace Interface ..................................18
7.4. External Components .............................................19
8. I/O Pins ............................................................................ 19
8.1. Unused Pin Termination ........................................19
8.2. Current Injection ....................................................20
9. ADC Circuitry ................................................................. 20
10. Communication Modules ................................................. 20
10.1. Example RS232 Interface ......................................21
10.2. Example LIN Interface ..........................................22
10.3. Example CAN Interface.........................................24
10.4. Ethernet Interface...................................................31
10.5. Zipwire Interface ...................................................33
11. References ....................................................................... 34
12. Revision history ............................................................... 34
Package Options
MPC574xP Hardware Design Guide, Application Notes, Rev. 3, 06/2020
2 NXP Semiconductors
Please note that information from the MPC574xP Reference Manual, Datasheet, and/or Errata report
may be repeated in this application note for the convenience of the reader. The reference manual,
datasheet, and errata report are the official specification for the MPC574xP and should be reviewed for
the most up-to-date information available for this device.
2. Package Options
The MPC574xP is available in the following packages:
• 144 pin Low Profile Quad Flag Package (144 LQFP)
• 257 pin Molded Array Process Ball Grid Array (257 MAPBGA)
The table below compares the features between the two packages:
Table 1. MPC574xP features differing by package
Feature
144 LQFP
257 MAPBGA
FlexPWM1
A[0-2]/B[0-2]
A[0-3]/B[0-3]/X[0-3]/Fault[0:3]
eTimer2
ETC2-5
ETC0-5
GPIO
79 GPIO, 26 GPI
112 GPIO, 29 GPI
CTU external trigger(s)
CTU0
CTU0, CTU1
ADCs
22 analog pads assigned to
ADC0, ADC1, ADC2, and
ADC3
Shared channels between
ADC0/ADC1, ADC0/ADC2,
and ADC1/ADC3
25 analog pads assigned to ADC0, ADC1,
ADC2, and ADC3
Shared channels between ADC0/ADC1,
ADC0/ADC2, ADC1/ADC3, and ADC2/ADC3
SIPI/LFAST
No
Yes
Ethernet
No
Yes
Nexus
Yes (MDO interface)
Yes (MDO interface)
Nexus Aurora Port
No
Yes (TX0/TX0_P/TX1/TX1_P/CLK/CLK_P)
The package selection should be based on the number of input/output pins required for the application
and the area available for the target system. The following table shows the size differences between the
packages. Package drawings are provided as separate documents from the NXP website. To find a
package drawing, go to http://www.nxp.com and perform a keyword search for the drawing's document
number.
Table 2. Size differences between packages
Package
Dimension
Pitch
Case Outline Document Number
144 LQFP
20 mm x 20 mm
0.5 mm
98ASS23177W
257 MAPGBA
14 mm x 14 mm
0.8 mm
98ASA00081D