mailto:processchange@centralsemi.com
https://www.centralsemi.com/process-change-notices
______________________________________________________________________________________
Page 1 of 2 R0
PCN # 203
Initial Notification Date:
August 5, 2021
Product / Process Change Notice
Parts Affected:
All devices manufactured in the SOIC-8 package.
Extent of Change:
The composition of the bond wire is changing from Gold (Au) to Copper/Palladium/Gold
(CuPdAu).
Reason for Change:
This change will insure an uninterrupted flow of product and provide increased flexibility
for supply chain management.
Effect of Change:
This change does not affect the form, fit, or function of any device.
Qualification:
Based on standards JESD22 and MIL-STD-750, qualification testing is in-process and data
will be provided when completed, approximately end Q3-2021.
Earliest Effective Date of Change:
To be determined after completion of qualification testing.
Part Numbers Affected:
CEN1374
CWDM3011N
CWDM3011P
CWDM305N
CWDM305ND
CWDM305P
CWDM305PD
mailto:processchange@centralsemi.com
https://www.centralsemi.com/process-change-notices
______________________________________________________________________________________
Page 2 of 2 R0
PCN # 203
Initial Notification Date:
August 5, 2021
As per JEDEC standard JESD46, Customer Notification of Product/Process Changes by
Solid-State Suppliers, a lack of acknowledgement of a PCN within thirty (30) days constitutes
acceptance of the change.
The undersigned acknowledges and accepts Central Semiconductor’s Product/Process
Change Notification (PCN).
Company Name:
Address:
Printed Name:
Title:
Signature:
Date: