DS892 (v1.19) September 22, 2020 www.xilinx.com
Product Specification 1
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Summary
The Xilinx® Kintex® UltraScale™ FPGAs are available in -3, -2, -1, and -1L speed grades, with -3 having the
highest performance. The -1L devices can operate at either of two V
CCINT
voltages, 0.95V and 0.90V and
are screened for lower maximum static power. When operated at V
CCINT
= 0.95V, the speed specification
of a -1L device is the same as the -1 speed grade. When operated at V
CCINT
= 0.90V, the -1L performance
and static and dynamic power is reduced.
DC and AC characteristics are specified in commercial, extended, industrial, and military temperature
ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical
parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed
grade industrial device are the same as for a -1 speed grade commercial device). However, only selected
speed grades and/or devices are available in each temperature range.
All supply voltage and junction temperature specifications are representative of worst-case conditions.
The parameters included are common to popular designs and typical applications.
This data sheet, part of an overall set of documentation on the UltraScale architecture-based devices, is
available on the Xilinx website at www.xilinx.com/documentation
.
DC Characteristics
Kintex UltraScale FPGAs Data Sheet:
DC and AC Switching Characteristics
DS892 (v1.19) September 22, 2020
Product Specification
Table 1: Absolute Maximum Ratings
(1)
Symbol Description Min Max Units
FPGA Logic
V
CCINT
Internal supply voltage –0.500 1.100 V
V
CCINT_IO
(2)
Internal supply v ol tag e for th e I/O banks –0.500 1.1 0 0 V
V
CCAUX
Auxiliary supply voltage –0.500 2.000 V
V
CCBRAM
Supply voltage for the block RAM memories –0.500 1.100 V
V
CCO
Output drivers supply voltage for HR I/O banks –0.500 3.400 V
Output drivers supply voltage for HP I/O banks –0.500 2.000 V
V
CCAUX_IO
(3)
Auxiliary supply voltage for the I/O banks –0.500 2.000 V
V
REF
Input reference voltage –0.500 2.000 V
V
IN
(4)(5)(6)
I/O input voltage for HR I/O banks –0.400 V
CCO
+ 0.550 V
I/O input voltage for HP I/O banks –0.550 V
CCO
+ 0.550 V
I/O input voltage (when V
CCO
= 3.3V) for V
REF
and differential I/O
standards except TMDS_33
(7)
–0.400 2.625 V
Kintex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics
DS892 (v1.19) September 22, 2020 www.xilinx.com
Product Specification 2
V
BATT
K ey memory battery backup supply –0.500 2.000 V
I
DC
Available output current at the pad –20 20 mA
I
RMS
Available RMS output current at the pad –20 20 mA
GTH and GTY Transceivers
V
MGTAVCC
Analog supply voltage for the GTH and GTY transmitter and
receiver circuits
–0.500 1.100 V
V
MGTAVTT
Analog supply voltage for the GTH and GTY transmitter and
receiver termination circuits
–0.500 1.320 V
V
MGTVCCAUX
Auxiliary analog Quad PLL (QPLL) voltage supply for the GTH and
GTY transceivers
–0.500 1.935 V
V
MGTREFCLK
GTH and GTY transceiv er reference clocks absolute input v oltage –0.500 1.320 V
V
MGTAVTTRCAL
Analog supply voltage for the resistor calibration circuit of the
GTH and GTY transceiver columns
–0.500 1.320 V
V
IN
Receiver (RXP/RXN) and Transmitter (TXP/TXN) absolute input
voltage
–0.500 1.260 V
I
DCIN-FLOAT
DC input current for rece ive r input pins DC coup led RX
termination = floating
–0
(8)
mA
I
DCIN-MGTAVTT
DC input current for rece ive r input pins DC coup led RX
termination = V
MGTAVTT
–10mA
I
DCIN-GND
DC input current for rece ive r input pins DC coup led RX
termination = GND
–10mA
I
DCIN-PROG
DC input current for rece ive r input pins DC coup led RX
termination = Programmable
–N/A
(8)
mA
I
DCOUT-FLOAT
DC output current for transmitter pins DC coupled RX
termination = floating
–0
(8)
mA
I
DCOUT-MGTAVTT
DC output current for transmitter pins DC coupled RX
termination = V
MGTAVTT
–6mA
System Monitor
V
CCADC
System Monitor supply relative to GNDADC –0.500 2.000 V
V
REFP
System Monitor reference input relative to GNDADC –0.500 2.000 V
Temperature
T
STG
Storage temperature (ambient) –65 150 °C
T
SOL
Maximum soldering temperature for Pb-free component bodies
(9)
– 260 °C
Maximum soldering temperature for Pb/Sn component bodies
(9)
– 220 °C
Table 1: Absolute Maximum Ratings
(1)
(Cont’d)
Symbol Description Min Max Units