n Fast acting thin film chip fuse for overcurrent protection
n 1005 (EIA 0402) miniature footprint
n Surface mount packaging for automated assembly
n UL listed (UL 248-14)
n RoHS compliant* and halogen free**
Electrical Characteristics
SF-0402F Series - Fast Acting Surface Mount Fuses
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
**Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Model
Rated Current
(Amps)
Fusing Time
Resistance
Tolerance ±25 %
(mΩ)***
Rated
Voltage
Breaking
Capacity
Typical
I
2
t (A
2
s)****
SF-0402F0315 0.315
Open within 1
min. at 200 %
rated current
690
DC 32 V DC32 V 35 A
0.00203
SF-0402F050 0.50 340 0.00317
SF-0402F075 0.75 140 0.0049
SF-0402F080 0.80 100 0.00532
SF-0402F100 1.00 95 0.00724
SF-0402F125 1.25 57 0.01344
SF-0402F150 1.50 45 0.01356
SF-0402F160 1.60 44 0.01672
SF-0402F200 2.00 33 0.01983
SF-0402F250 2.50 25 0.03763
SF-0402F300 3.00 19 0.05427
SF-0402F315 3.15 18 0.06304
SF-0402F400 4.00 12 0.0896
Reliability Testing
Parameter Requirement Test Method
Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % ......................................................... 105 °C ±5 °C,1000 hours
Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds
coating and marking
Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
UL File Number .........................................E198545
http://www.ul.com/FollowlinktoOnlineCerticatesDirectory,thenenterULFileNo.E198545,
or click here
SinglFuse
™
SF-0402F Series Features
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Asia-Pacic:
Tel: +886-2 2562-4117
Email: asiacus@bourns.com
Europe:
Tel: +36 88 520 390
Email: eurocus@bourns.com
The Americas:
Tel: +1-951 781-5500
Email: americus@bourns.com
www.bourns.com
Operating Temperature ..................................................................................-20 °C to +105 °C
Storage Conditions
Temperature ................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Moisture Sensitivity Level ........................................................................................................ 1
ESDClassication(HBM).............................................................................................. Class 6
Environmental Characteristics
*** Resistance value measured with less than 10 % of rated current.
****Typical I
2
t value measured at 10x rated current.
n Portable memory
n LCD monitors
n Disk drives
n PDAs
n Digital cameras
n DVDs
n Cell phones
n Rechargeable battery packs
n Battery chargers
n Set top boxes
n Industrial controllers
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-0402F Series - Fast Acting Surface Mount Fuses
Solder Reow Recommendations
Peak: 250 +0/-5 °C
230 °C or higher
PRE-HEATING ZONE
SOLDERING ZONE
HEATING TIME
180 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
250
200
150
TEMPERATURE (°C)
100
50
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
Peak: 250 +0/-5 °C
230 °C or higher
PRE-HEATING ZONE
SOLDERING ZONE
HEATING TIME
180 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
250
200
150
TEMPERATURE (°C)
100
50
150 °C
90 ± 30 Seconds
30 ± 10 Seconds
Product Dimensions Recommended Pad Layout
1.0 ± 0.1
(.039 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.558
(.022)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
1.55
(.061)
0.381
(.015)
1.0 ± 0.1
(.039 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.558
(.022)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
1.55
(.061)
0.381
(.015)
DIMENSIONS:
MM
(INCHES)
Thermal Derating Curve
120
110
100
90
80
-20 02040
AMBIENT TEMPERATURE (°C)
PERCENT OF RATING (%)
60 80 100 120
Construction & Material Content
OVERCOAT
Sn PLATING
CERAMIC SUBSTRATE
FUSE ELEMENT
Cu / Ni PLATING
1.0 ± 0.1
(.039 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.558
(.022)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.25 ± 0.1
(.010 ± .004)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
1.55
(.061)
0.381
(.015)
PACKAGING: 10,000 pcs./reel
SinglFuse
™
SF-0402F Series Applications