RClamp3346P
Final Datasheet Rev 5.0
Revision date 10/5/2016
www.semtech.com
1 of 9
Semtech
Features
• ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) +/-17kV (Contact), +/- 20 kV (Air)
IEC 61000-4-5 (Lightning) 5A (8/20 μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
• Package design optimized for high speed lines
• Flow-Through design
• Protects six high-speed lines
• Low capacitance: 0.65pF Maximum (I/O to Ground)
• Low ESD clamping voltage
• Low dynamic resistance: 0.15 Ohms (Typical)
• Solid-state silicon-avalanche technology
Mechanical Characteristics
• SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm)
• Pb-Free, Halogen Free, RoHS/WEEE compliant
• Lead Pitch: 0.4mm (intra-pair)
• Lead Finish: NiPdAu
• Marking: Marking code
• Packaging: Tape and Reel
Applications
• USB 3.0
• eSATA
• Display Port
• LVDS
RClamp3346P
Low Capacitance RClamp®
6-Line ESD Protection
Description
The RClamp®3346P provides ESD protection for
highspeed data interfaces. It features a high maximum
ESD withstand voltage of ±17kV contact and ±20kV
air discharge per IEC 61000-4-2. RClamp3346P is
designed to minimize both the ESD peak clamping and
the TLP clamping. Package inductance is reduced at
each pin resulting in lower peak ESD clamping voltage.
The dynamic resistance is among the industry’s lowest
at 0.15 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF allowing the RClamp3346P to
be used in applications operating in excess of 5GHz
without signal attenuation. Each device will protect up
to six lines (three high-speed pairs).
The RClamp3346P is in a 7-pin SGP2708N7 package
measuring 2.7 x 0.8mm with a nominal height of
0.50mm. The leads have a nominal pin-to-pin pitch of
0.40mm. Flow- through package design simplies PCB
layout and maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low
dynamic resistance, and innovative package design
enables this device to provide the highest level of ESD
protection for applications such as USB 3.0, eSATA, and
DisplayPort.
0.40 BSC
0.80 BSC
2.70
0.80
0.50
4 5 6 7
2
1 3
Package Dimension Schematic & Pin Conguration
6-Line protection
PROTECTION PRODUCTS
RClamp3346P
Final Datasheet Rev 5.0
Revision Date 10/5/2016
www.semtech.com
2 of 9
Semtech
Absolute Maximum Rating
Rating Symbol Value Units
Peak Pulse Current (t
p
= 8/20µs) I
PP
4.5 A
ESD per IEC 61000-4-2 (Air)
(1)
ESD per IEC 61000-4-2 (Contact)
(1)
V
ESD
±20
±17
kV
Operating Temperature T
J
-40 to +125
O
C
Storage Temperature T
STG
-55 to +150
O
C
Electrical Characteristics (T=25
O
C unless otherwise specied)
Parameter Symbol Conditions Min. Typ. Max. Units
Reverse Stand-O Voltage V
RWM
Any I/O to GND 3.3 V
Reverse Breakdown Voltage V
BR
I
BR
= 10μA 7 8 9 V
Reverse Leakage Current I
R
V
RWM
= 3.3V
Any I/O to GND
T = 25
O
C 0.01 0.05
μA
T = 125
O
C 0.150
Clamping Voltage V
C
tp = 8/20μs
Any I/O to GND
I
PP
= 1A 2.5 3.5
V
I
PP
= 4.5A 3.5 4.5
ESD Clamping Voltage
2
V
C
tp = 0.2/100ns
I
PP
= 16A 5.5
V
I
PP
= -16A -3
Dynamic Resistance (positive)
2,3
R
DYN
tp = 0.2/100ns 0.15
Ω
Dynamic Resistance (negative)
2,3
R
DYN
tp = 0.2/100ns 0.14
Junction Capacitance C
J
V
R
= 0V, f = 1MHz, Any I/O to GND 0.60 0.65
pF
V
R
= 0V, f = 1MHz, Between I/O pins 0.30 0.40
Notes
1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I
TLP
and V
TLP
averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from I
TLP
= 4A to I
TLP
= 16A