Silicon Microstructures, Inc. Confidential
THIS IS A CONTROLLED DOCUMENT. ANY PRINTED COPY OF THIS DOCUMENT IS AN UNCONTROLLED COPY
SILICON
MICROSTRUCTURES
I N C O R P O R A T E D
Title: RoHS Compliance Letter DOC #: 40SP0115.00
Revision Date: 08/05/11
Page 1 of 3
RoHS Directive and SMI’s Plan towards compliance
The RoHS Directive aim is simple – to restrict the use of six substances (See Figure 1 Below)
within electrical and electronic equipment (EEE), thereby contributing to the protection of human
health and the environment. While this is often called a Lead-Free Initiative, the other compounds
listed below may also be present in electronic assemblies.
Figure 1 – Restricted Materials under RoHS Directive
Substance
Maximum
Concentration
Lead – Pb 0.1 %
Mercury - Hg 0.1 %
Cadmium - Cd 0.01%
Hexavalent Chromium Cr (VI) 0.1 %
Polybrominated biphenyls – PBB 0.1 %
Polybrominated diphenyl ethers - PBDE 0.1 %
Article 1 of Commission decision 2005/618/EC states: 'For the purposes of Article 5(1)(a), a
maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury,
hexavalent chromium, polybrominated biphenyl’s (PBB) and polybrominated diphenyl ethers
(PBDE) and 0.01% by weight in homogeneous materials for cadmium shall be tolerated'
Although RoHS is a European Union (EU) Directive, manufacturers of EEE outside Europe must
also abide by this legislation if the equipment they produce is ultimately imported into a EU
member state.
The biggest impact for most assemblers of electronic product is that lead (Pb) is no longer an
acceptable component in solder. The solution has been to use a solder without lead, but this
alternate solder melts at a higher temperature. This requires a higher temperature reflow during
soldering. While conventional tin-lead can be reflowed at 230 to 235 C, the reflow temperature for
lead-free components needs to be in the 260 C range (depending on package size and
thickness). The agreed upon temperature ramp for soldering is found in IPC/JEDEC J-STD-
020D.1 - Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface
Mount Devices.
SMI products are Compliant
1. Die and wafer products -- All SMI die and wafer products are compliant to the RoHS
Directive.
2. All SOIC and Ceramic Packages are RoHS compliant. See table below.
Marking: SOIC packages are all compliant and are not marked. Compliant Ceramic Packages
are marked with an “R” in a conductor layer on the ceramic.
Silicon Microstructures, Inc. Confidential
THIS IS A CONTROLLED DOCUMENT. ANY PRINTED COPY OF THIS DOCUMENT IS AN UNCONTROLLED COPY
SILICON
MICROSTRUCTURES
I N C O R P O R A T E D
Title: RoHS Compliance Letter DOC #: 40SP0115.00
Revision Date: 08/05/11
Page 2 of 3
Table for SMI Packaged Products
Product Package Style
SM5420 SOIC-8 SMT
SM5430 SOIC-16 SMT
SM5470 SOIC-16 SMT
SM5651 DIP pinned Ceramic
SM5652 DIP pinned Ceramic
SM5822 SOIC-16 SMT
SM5852 DIP pinned Ceramic
SM5882 SOIC-16 SMT
While SMI has verified the packages on a profile conforming to the JEDEC standard, it is
recommended that the solder process be verified by the user before high-volume production.
SMI’s recommended solder reflow profile per JEDEC standard is below:
APPENDIX 1 –
Temperature Profile Requirements for Solder Re-flow for
Sn-Pb and Pb-Free Packages
Refer to the JEDEC J-STD-020D.1 for complete details. Tables 4-2, 4-3, and 5-2 are reproduced
here. Figure 5-1 describes the various zones of heating.
IPC/JEDEC J-STD-020D.1 - Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices http://www.jedec.org/download/search/jstd020d.pdf