Axial Lead Fuses
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
3.6 x 9mm > 777 Series
Description
Features
Agency Approvals
Agency Agency File Number Ampere Range
SU05024-13001 1.25A
E10480 1.25A
R 50267375 1.25A
PS
E
NBK111010-E10480 1.25A
CQC14012107199 1.25A
777 Series Axial Lead Fuse
• Enhanced
interrupting rating
Higher surge
withstand capability
Compact 3.6 x 9mm
footprint saves
board space
Epoxy Coating
Applications
Smartphone and tablet
wall-mount chargers
Power Supplies for
consumer electronics
The 777 Series is an axial lead 3.6mm x9mm fuse, designed
for overcurrent protection in electronic appliance charger
applications. The robust design enables the device to
withstand up to 24 hits of 7.5kV ringwave surge and, its
epoxy coating helps open safely on a direct short condition
without producing soot, sparks, sounds. The enhanced
electrical characteristics of the 777 Series make it ideal for
use in wall-mounted chargers for smartphones and tablets.
This series provides protection from catastrophic failures and
safety hazard when experiencing direct shorting on an AC
plug.
RoHS
Additional Information
Electrical Characteristics by Item
Amp Code
Voltage
Rating
Interrupting Rating
Nominal
Cold
Resistance
(Ohms)
Nominal
Melting
l
2
t (A
2
sec)
Agency Approvals
PS
E
1.25 250 V 50A @ 250 V AC 0.070 2.70 X X X X X
Electrical Characteristics for Series
% of Ampere
Rating
Opening Time
150% 1 hours, Minimum
275%
10 milliseconds, Minimum
3 seconds, Maximum
PS
E
Datasheet
Resources
Samples
Axial Lead Fuses
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
3.6 x 9mm > 777 Series
Temperature Rerating Curve Average Time Current Curves
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time: 60-180 seconds
Solder Pot Temperature:
260
° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Refl ow process.
Recommended Process Parameters: