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Tflex™ SF10 Application Guide
Shelf Life:
Shelf life for Tflex SF10 is 1 year from date of shipment at the storage conditions specified below.
Storage Conditions:
Recommended storage conditions are 0-35°C and relative humidity of 50% maximum. Store in original product
packaging until ready for use.
It is not recommended to store this material under excessive weight, as it is susceptible to deflection at very
low pressure.
Storage After Applied to a Component:
It is recommended to keep material covered and clean after applying it to a component and stored at ambient
conditions.
Handling of Material:
A light, visible and consistent residue on the liner is normal for this material and it will not affect the material’s
performance.
The gap filler is designed to be easily deflected in application (high compliancy) and can therefore stretch or
compress when handled.
Cut-Through Part Peeling Instructions:
Peel back one liner by separating it from the pad at one corner. Peel back the liner in one swift, consistent
motion as close to an 180° angle as possible.
Peel off the remaining clear liner by separating it from the pad at one corner. Peel back the liner in one swift,
consistent motion as close to an 180° angle as possible. Ensure you are peeling the liner from the pad. Do not
attempt to grasp the pad and peel it from the liner.
Peeling in a swift, consistent motion will result in a release with minimal pull out and a tacky pad surface. Do
not stop to inspect during the peeling process or ridges in the pad may occur. These ridges will press out
under light pressure of the application however and will not impact thermal performance of the material.
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A18319-00 Tflex SF10 Application Guide 1-19-21
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird
Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any
kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license
under any Laird Technologies or any third party intellectual property rights.
Cut-Through Part Application Instructions:
1. Remove the embossed (diamond) liner by separating it from the pad at one corner. Peel back the liner
in one swift, consistent motion as close to an 180° angle as possible.
2. Place the exposed side of the gap filler on the desired substrate by applying slight force to ensure the
gap filler sticks.
3. Peel off the remaining clear or embossed liner by separating it from the pad at one corner. Peel back
the liner in one swift, consistent motion as close to an 180° angle as possible.
Separation of Components and Removal of Tflex SF10
To remove Tflex SF10, its recommended to heat the component and scrape away remaining parts of the pad.
It is common for residue to be left after removing the pad from use. Residue can be wiped away with a dry
cloth. If excess residue remains, it can be cleaned further with mineral spirits, followed by acetone.