Product Information
curamik®
COOLING
SOLUTIONS
Rogers Corporation
www.rogerscorp.com
www.curamik.com
curamik® CoolPower
curamik® CoolPower Plus
The curamik® CoolPower consists of several layers of
pure copper with very fine structures. These layers create three-dimen-
sional structures for cooling high-performance electronics. During the
curamik bonding process, the different layers are hermetically combined
without any additional soldering or adhesive layers.
curamik® CoolPower Plus coolers are integrated DBC coolers with ce-
ramic substrates (Al
O
or AlN). The DBC substrate-layers enable direct
assembly of the components (chip on board) and provide at the same
time electrical isolation from the cooling circuit.
curamik® CoolPower and curamik® CoolPower Plus are used for the cool-
ing of high-performance components, high brightness LED or solar-cell
arrays.
The information contained in this document is intended to assist you in designing with Rogers’ Advanced Electronics Solutions
materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability
or fitness for a particular purpose or that the results shown in this document will be achieved by a user for a particular purpose.
The user should determine the suitability of Rogers curamik products for each application. The Rogers logo, the curamik logo and
curamik are trademarks of Rogers Corporation or one of its subsidiaries. © 2021 Rogers Corporation. All rights reserved.
Length ± . mm
Width ± . mm
Thickness ± . mm
Symmetry ± . mm
Flatness* Front area: . m,
complete: m
Surface roughness* R
a
≤ . m
Edge quality - m
Layer offset @ 1.5 mm
total thickness
< 0.15 mm
Etching tolerances 0.3 mm foils ± m
Holes + . mm / - . mm
+ etching tolerance /
- (etching tolerance + layer offset)
Material OFHC copper
Possible designs Open or closed version
Recommended layer stack-up x . mm + x . mm
(. mm after machining)
Available layer thickness (. mm); . mm; . mm;
. mm; . mm; . mm
O-Ring seat pocket (standard) . mm
Geometric properties
The curamik® CoolPerformance coolers are high per-
formance copper coolers for laser diode cooling. The
coolers consist of several layers of pure copper with
very fine structures. These layers create three-dimen-
sional micro- or macro-channel structures for cooling
laser diode bars up to mm cavity length.
Applications for these coolers are laser diode stacks
which are used in diode pumped lasers or direct diode
lasers for industrial, medical and research applications.
Length ± . mm
Width ± . mm
Thickness one-sided diamond-turned ± . mm
Thickness two-sided diamond-tur
-
ned
± . mm
Top copper thickness ± . mm
Symmetry . mm
Edge quality - m
Edge roughness R
a
≤ m
Flatness laser diode area @ 10 x 5
mm
2
≤ m
Flatness complete @ 30 x 15 mm
2
≤ m
Surface roughness Ni/Au top side R
a
≤ m
Surface roughness Cu top side R
a
≤ . m
Layer offset ≤ . mm
Etching tolerances @ 0.2 mm Cu ± . mm
Through holes ± ���. mm
Machined holes on request
Geometric properties
curamik® CoolPerformance Plus coolers are high per-
formance isolated copper coolers which additionally
contain an AlN isolation layer on top and bottom. The
AlN isolation layers separate the water channels from
the electrical contact to the laser diode and reduce the
CTE value of the cooler to – . ppm/K. The top and
front surface of these coolers can be diamond-milled to
meet the exacting needs of flatness of laser diodes.
Both types of coolers can be used with high power laser
diodes in the range of to more than W.
curamik® CoolPerformance Laser Diode Cooler curamik® CoolPerformance Plus Isolated Laser Diode Cooler
curamik® CoolPerformance
curamik® CoolPerformance Plus
curamik® CoolPower
curamik® CoolPower Plus
curamik® CoolEasy
High performance
liquid coolers for laser
diode applications
Liquid coolers for high power
applications like CPU for data
centers, direct cooled power
modules, high brightness LED
or solar-cell arrays (CPV)
Passive cooling
for laser diode
applications
Rogers offers two kinds of cooling solutions –
coolers for liquid or passive cooling.
For liquid cooling Rogers offers the curamik® CoolPower and CoolPower
Plus as well as the curamik® CoolPerformance and CoolPerformance Plus.
At the heart of these liquid coolers, there is a mircro or macro channel
structure made of thin copper foils that are put together into a hermeti-
cally tight block using the curamik bonding process. The specific channel
structure determines the thermal resistance, pressure drop and flow
rate. The coolant usually enters and exits through openings connected
with o-rings or screw fittings. Liquid coolers are an ideal solution for
high-power applications.
Advantages
// Four times more efficient cooling than traditional
module structures with liquid cooling
// Lower weight
// Smaller sizes
The curamik® CoolEasy is a high precise machined copper cooler for
passive laser diode cooling.
curamik® COOLING SOLUTIONS Product Information
Product Information
curamik®
COOLING
SOLUTIONS
Rogers Corporation
www.rogerscorp.com
www.curamik.com
curamik® CoolPower
curamik® CoolPower Plus
The curamik® CoolPower consists of several layers of
pure copper with very fine structures. These layers create three-dimen-
sional structures for cooling high-performance electronics. During the
curamik bonding process, the different layers are hermetically combined
without any additional soldering or adhesive layers.
curamik® CoolPower Plus coolers are integrated DBC coolers with ce-
ramic substrates (Al
O
or AlN). The DBC substrate-layers enable direct
assembly of the components (chip on board) and provide at the same
time electrical isolation from the cooling circuit.
curamik® CoolPower and curamik® CoolPower Plus are used for the cool-
ing of high-performance components, high brightness LED or solar-cell
arrays.
The information contained in this document is intended to assist you in designing with Rogers’ Advanced Electronics Solutions
materials. It is not intended to and does not create any warranties, express or implied, including any warranty of merchantability
or fitness for a particular purpose or that the results shown in this document will be achieved by a user for a particular purpose.
The user should determine the suitability of Rogers curamik products for each application. The Rogers logo, the curamik logo and
curamik are trademarks of Rogers Corporation or one of its subsidiaries. © 2021 Rogers Corporation. All rights reserved.