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DATA SHEET
W5643A DDR5 78-ball BGA Interposer
Overview
The W5643A DDR5 x4/x8 78-ball BGA interposer enables probing of embedded
memory DRAM from the ball grid array with Keysight Technologies, Inc. U4164A
logic analyzers. The Keysight W5643A DDR5 78-ball BGA interposers for logic
analyzers enable viewing of traffic on industry standard DDR5 78-ball DRAMs with
the Keysight U4164A logic analysis systems.
The W5643A DDR5 BGA interposers are designed to take full advantage of quad
sample state mode on U4164A modules with Option 02G, requiring only a single
probe point for up to four samples at two different thresholds. First in the industry,
the W5643A DDR5 BGA interposers are thinner than any previous BGA interposers
with a small KOV (keep out volume).
W5643A Series BGA interposers are designed to capture DDR5 protocol (CA/CS#/
CK) for data rates up to 5Gb/s and capture DDR5 DQ at data rates up to 4Gb/s.
1
1 Maximum transfer rates are subject to variables in the signal integrity of the system under
test and specifications of the U4164A logic analyzer module. U4164A specifications:
minimum eye size of 100mV x 100ps at the RC network on the W5643A, maximum CK
frequency of 2.5GHz, and maximum data rate of 4GT/s.
Key Benefits
• Probes a 78-ball DDR5
single channel x4 or x8
DRAM chip
• Access signals with one
each U4208A and U4209A
cables
• Measurement timing
skews within +/- 25 psec
• Interposers are delivered
with RC (resistor/
capacitor) networks
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The DDR5 BGA Interposer Advantage
Features Benefits
Connects directly to the DDR5 BGA balls. Eliminates reflections from mid-bus probing
methods. Also eliminates design time,
prototype builds, and trace routing required
to design in alternative probing methods.
Supports/Enables:
• DDR5 78 ball single die, stacked, or
quad x4, x8 DRAM at data rates up to
5Gb/s for protocol analysis and 4Gb/s
DQ capture.
• DDR eyescan display of DDR5 signals
into logic analyzer module from BGA
interposer
• DDR5, decode, functional compliance
and performance analysis using
optional licensed software
• Using APS (Advanced Probe Settings
2
)
Get complete signal access to the DDR5
signals critical to your debug.
Supports either leaded or lead-free solder. Easily works with all solder finishes.
Designed to tolerate lead-free soldering
temperature profiles.
Contract manufactures available for
those without the in-house expertise or
facilities for soldering BGAs.
Eliminates the need to develop BGA
soldering expertise.
Flexible “wings” with ZIF connectors. Ensures reliable connection to the ZIF
probes.
Enables placement of the probe cables
around adjacent components.
Minimizes the torque to the balls of the BGA.
2 To enable Advanced Probe Settings refer to Technical Overview 5991-0799EN.