16Leads‐SOICWBOpen Cavity
PackageMaterialDeclaration
Date 22‐Oct‐18 Productname IntegratedCircuit
PackageCode XG RoHSCompliant Y
PackageName OpencavityPlasticSmallOutline,300mil HalogenFree Y
ProductTotalMass(g) 0.40000 Plating NiPdAu
ProductNumber
MLX90809
MaterialDeclaration
MaterialName
Component
Weight(g)
CAS#
Element
ratio(%)
Material
Weight(g)
RatiototalWt
(ppm)
7440‐50‐8 97.15
0.08769
219217
7439‐89‐62.5
0.00226
5641
7723‐14‐00.15
0.00014
338
7440‐66‐60.2
0.00018
451
7440‐2‐0
86 0.00838
20941
7440‐05‐3
12 0.00117
2922
7440‐57‐5
2 0.00019
487
7440‐21‐3 99.99 0.02000
49995
‐ 0.01
0.00000200
5
7440‐22‐474
0.00097
2416
9003‐36‐56
0.00008
196
TradeSecret 6
0.00008
196
TradeSecret 8
0.00010
261
TradeSecret 4.2
0.00005
137
‐
1.8
0.00002
59
7440‐57‐5 99.99
0.00162
4041
‐ 0.01
0.00000016
0.4
TradeSecret 15
0.00219
5467
TradeSecret 75
0.01094
27337
96‐48‐03.4
0.00050
1239
TradeSecret 3.3
0.00048
1203
TradeSecret 3.3
0.00048
1203
60676‐86‐0 89.5
0.23494
587340
TradeSecret 5
0.01313
32812
TradeSecret 5
0.01313
32812
1333‐86‐40.5
0.00131
3281
Totalpackageweight(g)
0.40000
Comments
‐CompositionderivedfromMSDSandmaterialCoCfromvendors
‐Componentweightbasedonassemblyof���genericparts
‐Reliabilityqualificationreportsareavailableuponrequestthroughtheappropriatesalesormarketingcontact
‐ThirdpartytestingforRoHSsubstancesareavailableuponrequesttoenvironment@melexis.com
Disclaimer
EpoxyresinB
Diluent
Hardener
polysiloxane
Phosphorus(P)
Nickel(Ni)
Die SiliconIC 0.02000
Silicon(Si)
other
EpoxyresinA
other
FramePlating NiPdAu 0.00974
Palladium(Pd)
PartName MaterialComponent(Element)
Gold(Au)
Iron(Fe)
Wire Gold 0.00162
Gold(Au)
other
EpoxyResin
PhenolResin
CarbonBlack
Gelcoat FluorosiliconeRubber
Compound
0.01458 Flourine
AromaticAmine
GammaButyrolactone
MetalOxide
“MELEXIShastakeneveryefforttoensurethattheinformationprovidedin
thisdocumentiscorrect,accurateandup‐to‐date.
MELEXIS, however, shall not be held liable for any improper or incorrect use of t he information described and/or contained herein and assumes no responsibility whatsoever
for recipient’s or a third party’s use of this information. In no event MELEXIS shall be held liable for any direct, indirect, incidental, special, exemplary, or consequential
damages (including, but not limited to: procurement of substitute goods or services; l oss of use, data, or profits; or business interruption) however caused and on any theory of
liability, whether in contract, strict liability, tort (including negligence or otherwise), or any other theory arising in any way out of the use of this system, even if advised of the
possibilityofsuchdamage.
This��disclaimerofliabilityappliestoanydamagesorinjury,whetherbasedonallegedbreachofcontract,tortiousbehavior,negligenceoranyothercauseofaction”.
ThecontentofthisdocumentisCONFIDENTIAL&
PROPRIETARY.ALLRightsReserved.
Zinc(Zn)
Leadframe HighCopperAlloyC194 0.09026
Copper(Cu)
Dieattachmaterial Adhesive 0.00131 Silver(Ag)
Encapsulation Epoxyresin
G770HCD
0.26250 SilicaFused
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