8Leads‐SOIC_EP

PackageMaterialDeclaration

Date 30‐Oct‐2020 Productname IntegratedCircuit

PackageCode DC RoHSCompliant Y

PackageName PlasticSmallOutline150mil HalogenFree Y

ProductTotalMass(g) 0.07407 Plating PureMatteSn

ProductNumber

MLX80302

MaterialDeclaration

MaterialName

Component

Weight(g)

CAS#

Element

ratio(%)

Material

Weight(g)

RatiototalWt

(ppm)

7440‐50‐8 97.46 0.02215

299113

7439‐89‐6 2.35 0.00053

7212

7440‐66‐6 0.11 0.00003

338

7723‐14‐0 0.07 0.00002

215

7439‐92‐1 0.01 0.000002

Silver 0.00153 7440‐22‐4 100 0.00153

20635

7440‐21‐3

99.99

0.00263

35505

‐ 0.01

0.0000003

7440‐22‐4 92.5 0.00105

14112

‐ 7.5 0.00008

1144

7440‐50‐8 96.5 0.00029

3909

7440‐05‐3

3 0.00001

122

7440‐57

‐5

0.5 0.000002

7440‐31‐5 99.99 0.00137

18449

‐ 0.01

0.0000001

60676‐86‐0 88 0.03905

527288

‐ 11.5 0.00510

68907

1333‐86‐4 0.5 0.00022

2996

Totalpackageweight(g)

0.07407

Comments

‐CompositionderivedfromMSDSandmaterialCoCfromvendors

‐Componentweightbasedonassemblyofgenericparts

‐Reliabilityqualificationreportsareavailableuponrequestthroughtheappropriatesalesormarketingcontact

‐ThirdpartytestingforRoHSsubstancesareavailableuponrequesttoenvironment@melexis.com

Disclaimer

“MELEXIShastakeneveryefforttoensurethattheinformationprovidedinthisdocumentiscorrect,accurateandup‐to‐date.

MELEXIS, however, shall not be held liable for any improper or incorrect use of the information described and/or contained herein and assumes no responsibility

whatsoever for recipient’s or a third party’s use of this information. In no event MELEXIS shall be held liable for any direct, indirect, incidental, special, exemplary, or

consequential damages (including, but not limited to: procurement of substitute goods or services; loss of use, data, or profits; or business interr uption) however caused

and on any theory of liability, whether in contract, strict liability, tort (including negligence or otherwise), or any other theory arising in any way out of the use of this

system,evenifadvisedofthepossibilityofsuchdamage.

Thisdisclaimerofliabilityappliestoanydamagesorinjury,whetherbasedonallegedbreachofcontract,

tortiousbehavior,negligenceoranyothercauseofaction”.

ThecontentofthisdocumentisCONFIDENTIAL&PROPRIETARY.ALLRightsReserved.

Wire

Palladium

coatedCopper

0.0003

Copper(Cu)

Gold(Au)

0.0014

Others

0.04438

Phosphor(P)

Dieattachmaterial

SilverAdhesive

QMI529HT

0.0011

Silver(Ag)

Silicon(Si)

Others

Furtheradditives

Die Silicon 0.0026

Plating

Silver(Ag)

Encapsulation

EpoxyResin

G700LS

SilicaFused

CarbonBlack

LeadFinish Tin

Tin

(Sn)

Palladium(Pd)

EpoxyResin

PartName MaterialComponent(Element)

Leadframe

HighCopperAlloy

C194

0.02273

Copper(Cu)

Iron(Fe)

Zinc(Zn)

Lead(Pb)

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