3Leads‐��TSOT

PackageMaterialDeclaration

Date 28‐Aug‐20 Productname IntegratedCircuit

PackageCode SE RoHSCompliant Y

PackageName ThinSmallOutlineTransistor HalogenFree Y

ProductTotalMass(g) 0.01117 Plating PureMatteSn

ProductNumber

MLX91211

MaterialDeclaration

MaterialName

Component

Weight(g)

CAS#

Element

ratio(%)

Material

Weight(g)

RatiototalWt

(ppm)

7440‐50‐8

97.45

0.00441

395244

7439‐89‐62.4

0.00011

9734

7440‐66‐60.12

0.00001

487

7723‐14‐00.03

0.000001

122

Silver 0.00015 7440‐22‐4 100

0.00015

13430

7440‐21‐3 99.99 0.00076

67949

‐ 0.01

0.0000001

‐ 20

0.00007

6088

7440‐22‐4

0.00026

22831

‐

0.00002

1522

7440‐57‐5 99.99

0.00002

1790

‐ 0.01

0.000000002

0.2

7440‐31‐5 99.99 0.00026

23276

‐ 0.01

0.00000003

‐

0.00026

22876

60676‐86‐0

87.7

0.00448

401242

1333‐86‐4

0.3

0.00002

1373

29690‐82‐2

0.00010

9150

‐

0.00026

22876

Totalpackageweight(g)

0.01117

Comments

‐CompositionderivedfromMSDSandmaterialCoCfromvendors

‐Componentweightbasedonassemblyofgenericparts

‐Reliabilityqualificationreportsareavailableuponrequestthroughtheappropriatesalesormarketingcontact

‐ThirdpartytestingforRoHSsubstancesareavailableuponrequesttoenvironment@melexis.com

Disclaimer

“MELEXIShastakeneveryefforttoensurethattheinformationprovidedinthisdocumentiscorrect,accurateandup‐to‐date.

MELEXIS, however, shall not be held liable for any improper or incorrect use of the information described and/or contained herein and assumes no responsibility

whatsoever for recipient’s or a third party’s use of this information. In no event MELEXIS shall be held liable for any direct, indirect, incidental, special,exemplary,or

consequential damages (including, but not limited to: procurement of substitute goods or services; loss of use, data, or profits; or business interruption) however caused

and on any theory of liability, whether in contract, strict liability, tort (including negligence or otherwise), or any other theory arising in any way out of the use of this

system,evenifadvisedofthepossibilityofsuchdamage.

Thisdisclaimerofliabilityappliestoanydamagesorinjury,whetherbasedonallegedbreachof

contract,tortiousbehavior,negligenceoranyothercauseofaction”.

ThecontentofthisdocumentisCONFIDENTIAL&PROPRIETARY.ALLRightsReserved.

Encapsulation SilicaEP

G600

0.00511

Epoxyresin

Silicafused

CarbonBlack

EpoxyCresolNovolac

Phenolresin

LeadFinish Tin 0.00026

Tin(Sn)

others

Wire Gold 0.00002

Gold(Au)

others

Dieattachmaterial Silver‐EpoxyAdhesive

84‐1LMISR4

0.00034

Epoxyresin

Silver(Ag)

Aromaticamine

Frameplating Silver(Ag)

Die Silicon 0.00076

Silicon(Si)

others

PartName MaterialComponent(Element)

Leadframe HighCopperAlloy

C194

0.00453

Copper(Cu)

Iron(Fe)

Zinc(Zn)

Phosphorus(P)

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