CBGA
PackageMaterialDeclaration
Date 27Feb20 Productname IntegratedCircuit
PackageCode TC RoHSCompliant Y
Package��Name CeramicBallGridArray HalogenFree N
ProductTotalMass(g) 1.046 Plating Tin/Silver/Copperalloy
ProductNumber
MLX75027
MaterialDeclaration
MaterialName
Component
Weight(g)
CAS#
Element
ratio(%)
Material
Weight(g)
RatiototalWt
(ppm)
1344281 78.5 0.57768 552488
7631869 4 0.02576 24633
1305788 1 0.00736 7038
1309484 1 0.00736 7038
13463677 1.5 0.01104 10557
11118573 4 0.02944 28152
7440337 8.0 0.05887 56305
10241051 1 0.00736 7038
7440020 0.5 0.00368 3519
10124433 0.5 0.00368 3519
7440575 0.5 0.00368 3519
7440213 99.99 0.03110 29741
0.01 0.000003 3
14808607 51 0.11087 106039
1313593 8 0.01739 16634
12136
457 8 0.01739 16634
1314132 8 0.01739 16634
1344281 8 0.01739 16634
1303862 8 0.01739 16634
13463677 8 0.01739 16634
1309644 1 0.00217 2079
7440224 80 0.00608 5815
Proprietary 5 0.00038 363
Proprietary 5 0.00038 363
Proprietary 5 0.00038 363
5 0.00038 363
7440575 99 0.00297 2840
1 0.00003 29
80 0.00720 6886
3 0.00027 258
17 0.00153 1463
Proprietary 60 0.00048 459
Proprietary 25 0.00020 191
Proprietary 10 0.00008 77
5 0.00004 38
7440315 96.5 0.03860 36917
7440224 3 0.00120 1148
7440508 0.5 0.00020 191
13463677 61 0.00049 467
108941 7 0.00006 54
123864 5 0.00004 38
8052413 5 0.00004 38
95636 5 0.00004 38
25551137 5 0.00004 38
21645
512 5 0.00004 38
1330207 5 0.00004 38
108678 1 0.00001 8
100414 1 0.00001 8
Totalpackageweight(g)
1.046
Comments
‐CompositionderivedfromMSDSandmaterialCoCfromvendors
‐Componentweightbasedonassemblyofgenericparts
‐Reliabilityqualificationreportsareavailableuponrequestthroughtheappropriatesalesormarketingcontact
‐ThirdpartytestingforRoHSsubstancesareavailableuponrequesttoenvironment@melexis.com
Disclaimer
SealingGlue EpoxyAdhesive
8724L2
0.009 Epoxyprepolymer
Otheradditives
others
Bismaleimideresin
SilverAdhesive
QMI516
0.008
Additive
Photoinitiator
0.003Wire
Filter Glasswithout
declarablesubstances
0.217 Silica
SodiumOxide
PotassiumOxide
ZincOxide
AluminiumOxide
BoronOxide
TitaniumOxide
AntimonyTroxide
Gold Gold
Magnesiumoxide
Cobalt
Silicon 0.031 Silicon(Si)
Molybdenum
Nickel
Titaniumdioxide
Chromiumoxide
Tungsten
PartName MaterialComponent(Element)
Aluminumoxide
Gold
Adhesive
others
Die
Syntheticresin
Ceramicwithout
declarablesubstances
0.736
Silicondioxide
Calcium
oxide(cao)
Substrate
Methacrylateester
Silver
SAC305
96.5Sn/3Ag/0.5Cu
SolderBall
“MELEXIShastake neveryefforttoensurethattheinformationprovidedinthisdocumentiscorrect,accurateanduptodate.
MELEXIS, however, shall not be held liable for any improper or incorrect use of the information described and/or contained herein and assumes no responsibility
whatsoever for recipient’s or a third party’s use of this information. In no event MELEXIS shall be held liable for any direct, indirect, incidental, special, exemplary, or
consequential damages (including, but not limited to: procurement of substitute goods or services; loss of use, data, or profits; or business interruption) however
caused and on any theory of liability, whether in contract, strict liability, tort (including negligence or otherwise), or any other theory arising i n any way out of the use of
thissystem,evenifadvisedofthepossibilityofsuchdamage.
Thisdisclaimerof
liabilityappliestoanydamagesorinjury,whetherbasedonallegedbreachofcontract,tortiousbehavior,negligenceoranyothercauseofaction”.
ThecontentofthisdocumentisCONFIDENTIAL&PROPRIETARY.ALLRightsReserved.
Copper(Cu)
0.040 Tin(Sn)
Silver(Ag)
Titaniumdioxide
Cyclohexanone
1,3,5Trimethylbenzene
SolderFlux Rosin
TSF6502
0.001 Rosin
others
Glycolether
Propyleneglycolcompound
Ink
marking Titaniumwhite
4408RWhite
0.001
Ethylbenzene
nButylacetate
Stoddardsolvent
Pseudocumene
Trimethylbenzene
Aluminiumhydroxide
Xylenes(o, m,pisomers)
1 of 1