CBGA
PackageMaterialDeclaration
Date 27‐Feb‐20 Productname IntegratedCircuit
PackageCode TC RoHSCompliant Y
Package��Name CeramicBallGridArray HalogenFree N
ProductTotalMass(g) 1.046 Plating Tin/Silver/Copperalloy
ProductNumber
MLX75027
MaterialDeclaration
MaterialName
Component
Weight(g)
CAS#
Element
ratio(%)
Material
Weight(g)
RatiototalWt
(ppm)
1344‐28‐1 78.5 0.57768 552488
7631‐86‐9 4 0.02576 24633
1305‐78‐8 1 0.00736 7038
1309‐48‐4 1 0.00736 7038
13463‐67‐7 1.5 0.01104 10557
11118‐57‐3 4 0.02944 28152
7440‐33‐7 8.0 0.05887 56305
10241‐05‐1 1 0.00736 7038
7440‐02‐0 0.5 0.00368 3519
10124‐43‐3 0.5 0.00368 3519
7440‐57‐5 0.5 0.00368 3519
7440‐21‐3 99.99 0.03110 29741
‐ 0.01 0.000003 3
14808‐60‐7 51 0.11087 106039
1313‐59‐3 8 0.01739 16634
12136
‐45‐7 8 0.01739 16634
1314‐13‐2 8 0.01739 16634
1344‐28‐1 8 0.01739 16634
1303‐86‐2 8 0.01739 16634
13463‐67‐7 8 0.01739 16634
1309‐64‐4 1 0.00217 2079
7440‐22‐4 80 0.00608 5815
Proprietary 5 0.00038 363
Proprietary 5 0.00038 363
Proprietary 5 0.00038 363
‐ 5 0.00038 363
7440‐57‐5 99 0.00297 2840
‐ 1 0.00003 29
‐ 80 0.00720 6886
‐ 3 0.00027 258
‐ 17 0.00153 1463
Proprietary 60 0.00048 459
Proprietary 25 0.00020 191
Proprietary 10 0.00008 77
‐ 5 0.00004 38
7440‐31‐5 96.5 0.03860 36917
7440‐22‐4 3 0.00120 1148
7440‐50‐8 0.5 0.00020 191
13463‐67‐7 61 0.00049 467
108‐94‐1 7 0.00006 54
123‐86‐4 5 0.00004 38
8052‐41‐3 5 0.00004 38
95‐63‐6 5 0.00004 38
25551‐13‐7 5 0.00004 38
21645
‐51‐2 5 0.00004 38
1330‐20‐7 5 0.00004 38
108‐67‐8 1 0.00001 8
100‐41‐4 1 0.00001 8
Totalpackageweight(g)
1.046
Comments
‐CompositionderivedfromMSDSandmaterialCoCfromvendors
‐Componentweightbasedonassemblyofgenericparts
‐Reliabilityqualificationreportsareavailableuponrequestthroughtheappropriatesalesormarketingcontact
‐ThirdpartytestingforRoHSsubstancesareavailableuponrequesttoenvironment@melexis.com
Disclaimer
SealingGlue EpoxyAdhesive
8724L2
0.009 Epoxyprepolymer
Otheradditives
others
Bismaleimideresin
SilverAdhesive
QMI516
0.008
Additive
Photoinitiator
0.003Wire
Filter Glasswithout
declarablesubstances
0.217 Silica
SodiumOxide
PotassiumOxide
ZincOxide
AluminiumOxide
BoronOxide
TitaniumOxide
AntimonyTroxide
Gold Gold
Magnesiumoxide
Cobalt
Silicon 0.031 Silicon(Si)
Molybdenum
Nickel
Titaniumdioxide
Chromiumoxide
Tungsten
PartName MaterialComponent(Element)
Aluminumoxide
Gold
Adhesive
others
Die
Syntheticresin
Ceramicwithout
declarablesubstances
0.736
Silicondioxide
Calcium
oxide(cao)
Substrate
Methacrylateester
Silver
SAC305
96.5Sn/3Ag/0.5Cu
SolderBall
“MELEXIShastake neveryefforttoensurethattheinformationprovidedinthisdocumentiscorrect,accurateandup‐to‐date.
MELEXIS, however, shall not be held liable for any improper or incorrect use of the information described and/or contained herein and assumes no responsibility
whatsoever for recipient’s or a third party’s use of this information. In no event MELEXIS shall be held liable for any direct, indirect, incidental, special, exemplary, or
consequential damages (including, but not limited to: procurement of substitute goods or services; loss of use, data, or profits; or business interruption) however
caused and on any theory of liability, whether in contract, strict liability, tort (including negligence or otherwise), or any other theory arising i n any way out of the use of
thissystem,evenifadvisedofthepossibilityofsuchdamage.
Thisdisclaimerof
liabilityappliestoanydamagesorinjury,whetherbasedonallegedbreachofcontract,tortiousbehavior,negligenceoranyothercauseofaction”.
ThecontentofthisdocumentisCONFIDENTIAL&PROPRIETARY.ALLRightsReserved.
Copper(Cu)
0.040 Tin(Sn)
Silver(Ag)
Titaniumdioxide
Cyclohexanone
1,3,5‐Trimethylbenzene
SolderFlux Rosin
TSF‐6502
0.001 Rosin
others
Glycolether
Propyleneglycolcompound
Ink
marking Titaniumwhite
4408RWhite
0.001
Ethylbenzene
n‐Butylacetate
Stoddardsolvent
Pseudocumene
Trimethylbenzene
Aluminiumhydroxide
Xylenes(o‐, m‐,p‐isomers)
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