Key Features

Applications

• Density: 1 GB to 32 GB

• Chipkill support

• Fly-by command/address/control bus

with on-DIMM termination

• Higher bandwidth performance,

effectively up to 1866 MT/s

• Better performance at low power; 1.5V

(Normal) and 1.35V (Low Voltage)

• The Internet of Things (IoT)

• Networking systems

• Telecommunication

• Gaming

• Healthcare

• Industrial PCs

• Micro servers

Operating at 1.5V (normal) and 1.35V (low voltage) and with a transfer speed

of up to 1866 MT/s, ATP DDR3 modules deliver better performance while

consuming significantly less power than DDR2 memory.

ATP DDR3 modules are supported by the Intel® Core™ i7 Series, the AMD

AM3 Phenom™ processor, and the latest AMD Embedded Enterprise

Chipsets. DDR3 modules are not pin-compatible with the prior-generation

modules and have alignment notches preventing them from being inserted

into incompatible slots.

ATP offers DDR3 SDRAMs in a wide range of form factors and features

including SO-DIMM and Mini-DIMM with low profile, very low profile (VLP)

and ultra-low profile (ULP) options.

In addition to standard offerings, ATP’s DDR3 product line has enhanced

reliability options such as conformal coating for protection against dust,

chemicals, extreme temperatures and corrosion. The 30µ" thickness of the

gold finger plating ensures better durability and signal transmission quality.

Specifications

DDR3

DIMM Type

Density

Speed up to (MT/s)

RDIMM

1 GB to 32 GB

1866

ECC UDIMM

1 GB to 16 GB

1866

Non-ECC UDIMM

1 GB to 16 GB

1866

PCB Height*

Operating Temperature

Low profile /

VLP / ULP

Low profile /

VLP / ULP

Low profile /

VLP / ULP

0°C to 85°C /

-40°C to 95°C

0°C to 85°C /

-40°C to 95°C

ECC SO-DIMM

1 GB to 16 GB

1866

Low Profile

0°C to 85°C /

-40°C to 95°C

Non-ECC SO-DIMM

1 GB to 16 GB

1866

Low Profile

0°C to 85°C /

-40°C to 95°C

Mini-RDIMM

1 GB to 16 GB

1600

Low profile /

VLP / ULP

0°C to 85°C /

-40°C to 95°C

Mini-UDIMM

1 GB to 16 GB

1600

Low profile /

VLP / ULP

0°C to 85°C /

-40°C to 95°C

0°C to 85°C /

-40°C to 95°C

DDR3 8Gbit Component

Form Factor

ECC

Density

RDIMM

Yes

32 GB

VLP RDIMM

Yes

16 GB

UDIMM

16 GB

Org

Ranks

Component Org

Component Qty.

Speed up to (MT/s)

Technology

4G x 72 2G x 72 2G x 64

UDIMM ECC

Yes

16 GB

2G x 72

ULP UDIMM ECC

Yes

16 GB

2G x 72

SO-DIMM

16 GB

2G x 64

SO-DIMM ECC

Yes

16 GB

4 2 2 2 2 2 2

1G x 4 x 2R 1G x 4 x 2R 1G x 8 1G x 8 1G x 8 1G x 8 1G x 8

36 / 72 Die 18 / 36 Die 16 18 18 16 18

1333 1600 1600 1600 1600 1600 1600

DDP DDP Mono Mono Mono Mono Mono

2G x 72

* VLP: 0.74", ULP: below 0.74"

Anti-Sulfur

Resistors

Conformal

Coating

ATP DDR3

DRAM Solutions

Intense Performance for Intense Workloads

Test During

Burn-In (TDBI)

Thicker Gold Finger Complete Drive Test

Industrial

Temperature

TEL: +886-2-2659-6368

FAX: +886-2-2659-4982

sales-apac@atpinc.com

TEL: +1-408-732-5000

FAX: +1-408-732-5055

sales@atpinc.com

ATP EUROPEATP USAATP TAIWAN(HQ)

TEL: +49-89-374-9999-0

FAX: +49-89-374-9999-29

sales-europe@atpinc.com

ATP JAPAN

TEL: +81-3-6260-0797

FAX: +81-3-6260-0798

sales-japan@atpinc.com

TEL: +86-21-5080-2220

FAX: +86-21-9687-0000-026

sales@cn.atpinc.com

ATP CHINA

022021

To learn more about this product, contact your ATP Representative.

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