ABC'S DWG NO.
PROD.
NAME
AR-001C
SM□□□□□□□□L□-□□□
SPECIFICATION FOR APPROVAL
REV.
REF. :
PAGE 1
Multilayer Chip Bead
Ⅰ﹒Configuration and dimensions：
Ⅲ﹒General specification：
A B
C
G H I
D
Unit：mm
d﹒Product weight：10.0 (2029) / 5.4 (1608) mg（ref.）
c﹒Terminal strength：
F
Type F ( kgf ) Time ( sec )
30±5
b﹒Operating temp.：-55℃ ---- +125℃
a﹒Storage Conditions：
Electrical Performance temp：-55℃ ---- +125℃
Terminal Solderability & Packages Material temp：-10℃ ---- +40℃ and RH 70% max.
Peak Temp：260℃ max.
Max time above 217℃ ：60sec~150sec max.
Temperature
Temperature ( )
℃
0
50
100
50
200
150
250
Rising Area
+4.0 / sec max.℃ -(1.0 ~ 5.0) / sec max.℃
Forced Cooling Area
Peak Temperature:
Time ( seconds )
100 150 200
260℃
Preheat Area
150 ~ 200 / 60 ~ 120sec ℃
Reflow Area
+3.0 / sec max.℃
250
217℃
60sec max.
60sec~120sec
60sec~150sec
Max. Peak Temp - 5℃：30sec max.
20191111-G
Ⅱ﹒Materials：
a﹒Body：Ferrite
b﹒Internal conductor：Silver
c﹒Terminal electrode：Ag / Ni / Sn
e﹒Products comply with RoHS' requirements
f﹒Halogen free
Solder temp. : 260℃
d﹒Resistance to soldering heat：
Dip time :10 sec max.
D
D
A
C
B
( PCB Pattrn )
I
G
I
H
SM1608
SM2029
Series
SM2029
SM1608
2.0 ± 0.2
1.6 ± 0.2
1.2 ± 0.2
0.8 ± 0.2 0.8 ± 0.2
0.9 ± 0.2 0.50 ± 0.3
0.30 ± 0.2
0.8
0.7 0.7
1.0
0.7
1.0
0.6
0.5
PROD.
NAME
AR-001C
SPECIFICATION FOR APPROVAL
REV. PAGE 2
ABC'S DWG NO.
Ⅳ﹒ Electrical characteristics：
REF. :
Ⅴ﹒Curve：
1). Electrical specifications at 25℃
6000.205±25%SM1608050YL□-□□□
SM1608300YL□-□□□
SM1608090YL□-□□□
30±25%
9±25%
0.20
0.20
400
500
(mA)(Ω)(Ω)
DWG. No.
SM2029110YL□-□□□
SM2029100YL□-□□□
SM2029070YL□-□□□
11±25%
10±25%
7±25%
0.15
0.15
0.15
at 100MHz max.
600
600
600
max.
Impedance RDC IDC
SM1608050YL□ SM1608300YL□SM1608090YL□
SM2029070YL□ SM2029110YL□SM2029100YL□
1000
SM□□□□□□□□L□-□□□
Multilayer Chip Bead
20191111-G