Max time above 200 70sec max.
+2.0 ~ 4.0
Reflow Area
/ sec max.
50sec max.
70sec max.
100
Frequency ( MHz )
Impedance ( Ω )
MB8530-L-□□□ 90±20% 9.0
1
1
10
10
cResistance to Solder heat260 10 secs
bOperating temp.-40 ---- +105
aStorage temp.-40 ---- +125
Series
MB4030-L-□□□
50
47±20%
@100MHz@25MHz
(mΩ)
6.0
RDC
100
0
50
Time ( seconds )
100 150
Temperature ( )
100
150
200
150 ~ 200 / 60 ~ 120sec +4.0 / sec max.
250
Rising Area
Temperature
Preheat Area
MB4030
MB8530
200 250
-(1.0 ~ 5.0) / sec max.
Peak Temperature:
230
260
Forced Cooling Area
4.5
1.0
I
C
C'
MB8530
MB4030
Series
3.0±0.2
2.6±0.19.0±0.68.5±0.2
3.0±0.2
Max time above 230 50sec max.
Peak Temp260 max.
2.00 typ.2.85±0.20 1.20 typ.
2.6±0.1
CA'
4.6±0.54.0±0.2
A
A'
B
DD
E
PCB Pattern
1.35 typ.
DC'
2.85±0.20 1.20 typ.
E
G
G
I
A
B
1.8 3.0
1.8
H
3.0
I
H
ZZ
(Ω)(Ω)
60±20%
30±20%
+0
+0
ABC'S DWG NO.
PROD.
NAME
AR-001C
MB□□□□□□□□L-□□□
SPECIFICATION FOR APPROVAL
REV.
REF. :
PAGE 1
Wound Chip Bead
Ⅰ﹒Configuration and dimensions
Ⅲ﹒General specification
Unitmm
cProduct weight0.180 (4030) / 0.325 (8530) gref.
Ⅳ﹒ Electrical characteristics
20191111-D
Ⅱ﹒Materials
aBodyFerrite
bTerminalTinned copper flate t=0.2 mm
eProducts comply with RoHS' requirements
fHalogen free
1). Electrical specifications at 25
2). Ratted Current5 Amps.
dMoisture sensitivity Level 1
P:8 mm
G.W. (g)
Inner : Reel
MB8530 500 220
Code
MB4030
Q'TY (pcs)
500 150
41 x 39 x 22
41 x 39 x 22
Outer : Carton
15,000
07 - 16
8.0
20,000
Q'TY (pcs)Style
07 - 12
G.W. (kg)
7.5
Size (cm)
Components
178 21±0.807 - 12
( 3 ) Q'TY & G.W. Per package
07 - 16 178 21±0.8
( 2 ) Dimensions
Style BA
no component
200 mm min.
Leader
50
50
141213
13 16 18
+0
DC G
+0
16.5
-0
20.5
TN
-0
Unit:mm
400 mm min.
User direction of feed
no component
Trailer
A
End
B
C
2.0±0.5
C
���Carrier tape width : D
Embossed Carrier
4 mm
G
Strat
D
N
T
Cover Tape
( 1 ) Configuration
ABC'S DWG NO.
PROD.
NAME
AR-001C
Ⅴ﹒ Packaging information
SPECIFICATION FOR APPROVAL
REV. PAGE 2
REF. :
B
MB□□□□□□□□L-□□□
Wound Chip Bead
20191111-D